Solid-State Storage Cooling Channel for Heat Dissipation and SNIA Compliance
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Solution Overview
Problem
Conventional solid-state storage devices face challenges in heat dissipation due to increased power consumption, especially for larger devices, and lack effective water-cooled designs that comply with specifications like E3S/ESL.
Innovation Solution
A solid-state storage device design incorporating a heat dissipation unit with a cooling channel and restriction stages, thermally connected to the storage module, which includes a working fluid and heat conductive ribs to enhance heat removal, while adhering to specifications such as SNIA SFF-TA-1008.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water-cooled heat dissipation design is employed, then heat dissipation performance is improved, but device width increases beyond 22.5mm
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by introducing a cooling channel that extends vertically through the case. The cooling channel connects to heat dissipation fins arranged in multiple layers, transforming the heat dissipation path from two-dimensional surface area to three-dimensional volume, thereby achieving effective heat dissipation without increasing the device width beyond 22.5mm
Solution Approach 2:
The heat dissipation system is segmented into multiple independent components: the cooling channel, the heat dissipation fins divided into multiple layers, and the mounting plate. This segmentation allows each component to be optimized independently for thermal performance while maintaining compatibility with the standard device width specification
2Temperature
If heat dissipation unit is added, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the cooling channel, heat dissipation fins, mounting plate, and thermal interface material into an integrated heat dissipation unit that functions as a single assembly. This merging reduces the number of separate components and simplifies installation while maintaining effective heat dissipation performance
Solution Approach 2:
The heat dissipation unit serves multiple functions simultaneously: the cooling channel provides fluid flow paths for active cooling, the heat dissipation fins provide surface area for heat radiation, the mounting plate provides mechanical attachment, and the thermal interface material provides thermal conduction. This multi-functionality reduces overall system complexity
3Device complexity
If conventional heat dissipation design is used, then device simplicity is maintained, but heat dissipation capability is insufficient for increased power consumption
Solution Approach 1:
The patent introduces a liquid cooling system using a cooling channel through which coolant circulates to actively remove heat from the storage device. This hydraulic approach provides superior heat dissipation capability compared to passive air cooling, effectively handling the increased power consumption while maintaining a relatively simple integrated design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces device thickness and power consumption, improves heat conduction, and simplifies assembly by reducing bolt count, while maintaining compliance with industry specifications.
Implementation Method 1
the heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module
Implementation Method 2
The working fluid travels through the cooling channel
Data Source
AI summary
A solid-state storage device is provided. The solid-state storage device includes a case, a solid-state storage module and a heat dissipation unit. The case includes a receiving space. The solid-state storage module is disposed in the receiving space of the case. The heat dissipation unit is connected to the case. The heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module. The heat dissipation unit includes a working fluid and a cooling channel. The cooling channel extends in the heat dissipation unit. The working fluid travels through the cooling channel. The heat dissipation unit comprises a plurality of restriction stages. The restriction stages abut the solid-state storage module and restrict the solid-state storage module. The solid-state storage device satisfies the SNIA SFF-TA-1008 specification.