Solid State Switching Device Heatsink Thermal Isolation
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Solution Overview
Problem
Solid state switching devices, such as relays and power modules, face limitations in heat dissipation due to metal heatsinks posing thermal and electrical hazards, and traditional enclosures that trap heat, restricting power handling capacity.
Innovation Solution
A solid state switching device with a heatsink in thermal contact, an enclosure featuring ventilation openings for air flow, and spacers allowing side-by-side mounting with air circulation, enabling heat dissipation through radiation and convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal heatsinks are used to remove heat from solid state devices, then heat dissipation is improved, but thermal and electrical shock hazards are created
Solution Approach 1:
The patent introduces an enclosure as an intermediary between the metal heatsink and the external environment. This enclosure acts as a mediator that allows heat transfer functions to be maintained while eliminating direct contact hazards. The enclosure provides thermal and electrical isolation, preventing both thermal shock and electrical shock hazards while still enabling effective heat dissipation through the heatsink structure.
Solution Approach 2:
The patent employs a non-conductive enclosure material that serves as a protective barrier. This enclosure can be made from inexpensive materials that provide adequate thermal and electrical insulation for the intended application lifespan, effectively neutralizing hazards without requiring complex or expensive safety systems.
2Object-affected harmful factors
If heatsinks are enclosed to avoid thermal and electrical hazards, then safety is improved, but heat dissipation is reduced
Solution Approach 1:
The patent applies local quality by providing thermal and electrical isolation only where hazards exist (at the external surfaces of the enclosure), while maintaining thermal conduction pathways internally. The enclosure is designed to be insulating on the outside for safety, but allows heat transfer on the inside where it contacts the heatsink, thus achieving both safety and effective heat dissipation simultaneously.
3Productivity
If devices are mounted side-by-side to increase power density, then space utilization is improved, but co-heating between devices increases
Solution Approach 1:
The patent incorporates spacers that physically segment and separate adjacent devices mounted side-by-side. These spacers create thermal zones that prevent heat accumulation and co-heating between devices. By dividing the mounting space into separated sections, the system achieves high power density while maintaining effective thermal management through reduced thermal interaction between adjacent units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances power dissipation capacity, increases load current ratings, and reduces co-heating between devices, achieving higher power density with improved thermal and electrical isolation.
Implementation Method 1
a heatsink (27), a solid state switching element (31) in heat conductive relationship with the heatsink
Implementation Method 2
the heatsink has fins (48) and ducts (46, 47) aligned with ventilation openings in the enclosure for removing heat by radiation and convection
Implementation Method 3
the heatsink has fins (48) and ducts (46, 47) aligned with ventilation openings in the enclosure for removing heat by radiation and convection
Data Source
Figure 1~3
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Figure 8~10
AI summary
Solid state switching device having a heatsink, a solid state switching element in heat conductive relationship with the heatsink, and an enclosure having ventilation openings adjacent to the heatsink through which air can flow to remove heat from the heatsink. In some disclosed embodiments, the heatsink has fins and ducts aligned with ventilation openings in the enclosure for removing heat by radiation and convection. In others, the heatsink is a generally planar baseplate, with ventilation openings in a side wall of the enclosure next to the baseplate for removing heat from the device. Spacers project laterally from the devices and permit a plurality of the devices to mounted side-by-side with space between the devices through which air can flow.