Solid State Apparatus Terminal Segmentation for Optical Flatness
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Solution Overview
Problem
Solid state apparatuses experience image distortion and reliability issues due to environmental stress causing distortion of the translucent member, which is exacerbated by uneven thickness of the sealing resin leading to volume variations and subsequent stress.
Innovation Solution
The solid state apparatus design includes a printed circuit board with first and second regions, where the second terminals are only arranged in the first region, allowing the second region to be flexible and preventing stress-induced distortion of the translucent member, thereby maintaining optical accuracy and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the second terminals are arranged in both the first region and the second region, then the electrical connection is more comprehensive, but the stress-induced distortion of the translucent member increases
Solution Approach 1:
The patent segments the terminal arrangement by spatially separating the first terminals (connected to semiconductor chip) from the second terminals (on opposite surface). This segmentation allows the second terminals to be positioned only in the first region, preventing them from contributing to stress in the second region while maintaining electrical connectivity through the printed circuit board.
Solution Approach 2:
The patent applies local quality by making the terminal distribution non-uniform across the printed circuit board. Second terminals are arranged only in the first region (inward of semiconductor chip outer edge) and not in the second region (outward of outer edge). This localized arrangement ensures electrical connectivity where needed while avoiding stress concentration in the second region that would distort the translucent member.
2Reliability
If the sealing resin thickness is increased to improve coverage, then the sealing performance is improved, but the volume variation and stress increase
Solution Approach 1:
The patent addresses sealing resin thickness variation by localizing the second terminals to the first region. This allows the sealing resin to have sufficient thickness for sealing performance in critical areas while reducing the overall volume variation that causes stress. The non-uniform terminal arrangement compensates for the reduced stress by maintaining electrical connectivity in the region where terminals are present.
3Manufacturing precision
If the translucent member is made more rigid to maintain flatness, then the optical accuracy is improved, but the stress concentration increases
Solution Approach 1:
The patent extracts the source of stress concentration by removing second terminals from the second region. This eliminates a potential stress concentration point that would interact with the translucent member. The translucent member can thus maintain its rigidity for optical accuracy without being subjected to additional stress from terminal arrangements in the second region.
Data Source
AI summary
A solid state apparatus comprising, a printed circuit board having a first and a second surface that are opposite surfaces, a semiconductor chip for imaging arranged on the first surface, a sealing resin arranged to cover the printed circuit board and the semiconductor chip, and a translucent member arranged on the sealing resin, the solid state apparatus having a first region located inward of an outer edge of the semiconductor chip, and a second region located outward of the outer edge, the printed circuit board comprising, on the first surface, a first terminal electrically connected to the semiconductor chip, and comprising, on the second surface, a second terminal electrically connected to the first terminal within the printed circuit board, the second terminal being arranged in the first region.