Solid-State Transition Piece for Component Carrier Embedding
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Solution Overview
Problem
The increasing miniaturization and complexity of electronic components on component carriers pose challenges in effectively embedding these components while ensuring high mechanical integrity and efficient heat removal, particularly due to the shrinking spacing between contacts and the need for robust mounting under harsh conditions.
Innovation Solution
A semifinished product and method involving a solid-state transition piece that becomes adhesive upon heat or pressure application, fully or partially encircling the component to fill gaps between the component and the carrier material, providing mechanical robustness and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are miniaturized with smaller spacing between contacts, then component functionality and integration density are improved, but mechanical integrity and heat removal become increasingly difficult
Solution Approach 1:
The patent introduces a solid-state transition piece as an intermediary element between the electronic component and the component carrier. This transition piece is arranged in a recess and surrounds the component, providing mechanical support and stability. When heated or pressurized, it transforms into an adhesive state to fill gaps and bond the component securely to the carrier, thereby maintaining mechanical integrity even as component size decreases and spacing shrinks.
2Productivity
If electronic components are miniaturized with smaller spacing between contacts, then component functionality and integration density are improved, but heat removal becomes an increasing issue
Solution Approach 1:
The solid-state transition piece serves as a thermal intermediary between the miniaturized electronic component and the component carrier. In its solid state, it provides structural support; when transformed into adhesive state through heat or pressure, it fills gaps and creates thermal pathways that facilitate heat removal from the densely packed components, addressing the heat dissipation challenge inherent in high-integration-density designs.
3Strength
If a solid state transition piece is used to enclose the component, then mechanical integrity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes parameter changes by employing a solid-state transition piece that can transform into an adhesive state through changes in temperature or pressure. This allows the same material to serve dual functions: providing mechanical support in solid form and creating strong bonds in adhesive form. The transition piece is placed in a pre-formed recess, which simplifies positioning and ensures proper enclosure of the component without requiring complex manufacturing steps.
4Ease of manufacture
If liquid material is used to fill the gap between component and layer, then manufacturing simplicity is improved, but mechanical integrity under harsh conditions deteriorates
Solution Approach 1:
Instead of using liquid material that remains in liquid or semi-liquid state, the patent employs a solid-state transition piece that transforms into an adhesive state only when subjected to heat or pressure during manufacturing. After bonding, it returns to or remains in a solid state, providing robust mechanical integrity. This approach maintains manufacturing simplicity while ensuring the adhesive material has the structural strength needed to withstand harsh operating conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables simple and efficient embedding of electronic components with improved mechanical integrity and thermal management, allowing for the integration of components with diverse materials and shapes, while reducing mechanical tension and thermal mismatch.
Implementation Method 1
the solid-state transition piece comprises or consists of a material being or becoming adhesive in a liquid state and being liquefiable by heat and/or pressure
Data Source
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AI summary
An auxiliary structure (100) for embedding a component (102) in a component carrier (104), the auxiliary structure (100) comprising a solid state transition piece (106) for at least partially, in particular substantially fully circumferentially, enclosing the component (102), wherein the solid-state transition piece (106) comprises or consists of a material being or becoming adhesive in a liquid state and being liquefiable by heat and/or pressure so as to fill a gap between the component (102) and surrounding component carrier material (108) by applying heat and/or pressure.