Solid Substitution Electroless Plating Device for Thick Uniform Metal Films
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Solution Overview
Problem
The electroless plating method faces challenges in achieving uniform and thick metal film formation due to its slow film forming rate, which results in high costs and limitations in maximum film thickness, while electroplating methods struggle with uniformity and local corrosion during gold plating on nickel substrates.
Innovation Solution
A solid substitution-type electroless plating method using a film formation device with a conductive mounting base, a third metal, an insulating material, a microporous membrane, and a plating bath chamber, where the microporous membrane is impregnated with a substitution-type electroless plating bath, allowing for a redox reaction between the third metal and the substrate to promote a substitution reaction and achieve thick film thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electroless plating method is used, then uniform metal film formation is achieved, but film forming rate is slow and maximum film thickness is limited
Solution Approach 1:
The invention divides the plating process into two distinct stages: (1) electroless plating stage for achieving uniform thin film formation, and (2) electroplating stage for achieving thick film formation at high speed. This segmentation allows each method to operate in its optimal performance range without the limitations of using either method alone.
Solution Approach 2:
The invention employs periodic action by sequentially applying electroless plating first, then electroplating in subsequent steps. This periodic alternation between two different plating mechanisms enables the system to achieve both uniformity (from electroless plating) and high productivity (from electroplating) in a multi-stage process.
2Productivity
If electroplating method is used, then fast film forming rate is achieved, but uniform metal film formation is difficult due to local corrosion
Solution Approach 1:
The invention applies preliminary action by performing electroless plating first to create a uniform foundational layer before conducting electroplating. This preliminary uniform layer prevents local corrosion during the subsequent electroplating stage, as the electroless layer acts as a protective and uniform substrate that eliminates the initiation sites for corrosion.
3Reliability
If substitution-type electroless plating is used for gold plating on nickel, then oxidation prevention is achieved, but local corrosion occurs and uniform film formation is difficult
Solution Approach 1:
The invention segments the gold plating process into two stages: first performing electroless gold plating to achieve oxidation prevention and uniform initial coverage, then performing electroplating to achieve uniform thick film formation. This segmentation eliminates the local corrosion problem that occurs when relying solely on substitution-type electroless plating for thick uniform films.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of thick, uniform metal films by creating a local anode reaction in the third metal, inducing a local cathode reaction and promoting a substitution reaction, thereby overcoming the limitations of both electroless and electroplating methods in terms of speed and uniformity.
Implementation Method 1
The microporous membrane is adapted to be impregnated with a substitution-type electroless plating bath containing ions of a first metal. The substitution-type electroless plating bath is delivered to a plating film of a second metal on a base material through the microporous membrane.
Implementation Method 2
The third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal. By installing the insulating material between the base material and the third metal, a local anode reaction of the third metal induces a local cathode reaction, thereby promoting a substitution reaction.
Implementation Method 3
The third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal.
Data Source
AI summary
Provided is a device and a method for forming a metal plating film having a thick film thickness by a solid substitution-type electroless plating method. The present disclosure relates to a film formation device for forming a film of a first metal on a plating film of a second metal by a solid substitution-type electroless plating method, comprising: a conductive mounting base; a third metal; an insulating material; a microporous membrane; a plating bath chamber; and a pressing unit, wherein the third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal, and wherein the insulating material is installed between a base material and the third metal so as to contact respective materials of the base material and the third metal when the base material having the plating film of the second metal is installed.