Solid Thermally-Conductive Material for Conformable Heat Dissipation

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Solution Overview

Problem

Conventional thermal interface materials (TIMs) face issues with low suitability for production lines, design flexibility, and performance degradation due to long-term use and repetition, particularly in conforming to complex shapes and maintaining thermal conductivity.

Innovation Solution

A solid thermally-conductive material composed of an amorphous thermoplastic resin and heat dissipation filler, with specific properties to maintain stability and flexibility, allowing for easy handling and conformability to complex shapes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thermal grease is used to conform to irregularities and increase thermal conduction efficiency, then thermal conduction efficiency is improved, but handleability and suitability for production lines deteriorate due to liquid state

Engineering Contradiction:

Improvethermal conduction efficiencyVSAvoidhandleability

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The invention changes the physical state parameter from liquid to solid by using a solid thermally-conductive material instead of liquid thermal grease, thereby improving handleability and suitability for production lines while maintaining thermal conduction efficiency through the solid material's ability to conform to irregularities

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses a composite material consisting of a solid thermally-conductive material that combines the conformability of liquid materials with the handling advantages of solids, resolving the contradiction between thermal conduction efficiency and ease of operation

Inventive Principle:

Principle #40Composite materials

2Reliability

If thermal grease is used to fill space between parts with different thermal expansion characteristics, then thermal conduction is improved, but pump-out phenomenon occurs and reliability deteriorates due to liquid extrusion

Engineering Contradiction:

Improvethermal conduction efficiencyVSAvoidlong-term use reliability

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The invention changes the physical state from liquid to solid, eliminating the pump-out phenomenon that occurs with liquid thermal grease under thermal expansion and contraction, thereby improving long-term use reliability while maintaining thermal conduction efficiency

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention converts the potential harm of pump-out phenomenon by using a solid material that remains in place under thermal stress, transforming the design approach to prevent the harmful effect rather than merely mitigating it

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If PCM is used to become liquid at operating temperature to conform to irregularities, then thermal conduction efficiency is improved, but volume change and state change occur causing reliability deterioration

Engineering Contradiction:

Improvethermal conduction efficiencyVSAvoidstate stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The invention uses a solid thermally-conductive material that maintains a stable solid state across operating temperatures, eliminating the repeated phase changes and volume fluctuations of PCMs while still achieving conformability to irregularities and maintaining thermal conduction efficiency

Inventive Principle:

Principle #35Parameter changes

4Ease of manufacture

If heat dissipation sheet is used to control thickness and shape, then ease of manufacture is improved, but ability to conform to complex irregularities deteriorates due to solid sheet rigidity

Engineering Contradiction:

Improvethickness controlVSAvoidconformability to irregularities

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The invention uses a solid thermally-conductive material that can be applied and conform to irregularities in a manner similar to liquid materials, then cured or set to maintain the conforming shape, thereby achieving both ease of manufacture and conformability to complex irregularities

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The material provides high suitability for production lines, design flexibility, and maintains thermal conductivity without performance degradation over time, ensuring effective heat dissipation.

Implementation Method 1

the solid thermally-conductive material is softened at the time of IC operation

Methodology Applied

Scientific EffectPhase transition: Phase Change

Implementation Method 2

efficient dissipation of unnecessary heat generated in the inside of an electronic device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4640789A1Solid thermally-conductive material

Publication Date: 2025.10.29 RESONAC CORP

Figure 1

AI summary

Provided is a TIM that overcomes disadvantages of conventional TIMs, has high suitability for existing production lines and high suitability for design, and is less prone to reduce the performance due to long-term use and repetition use. A solid thermally-conductive material comprising an amorphous thermoplastic resin and a heat dissipation filler.