Solid Tin Supply Apparatus for EUV Light Source

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Solution Overview

Problem

The existing EUV light source apparatus requires frequent replenishment of high temperature plasma raw materials, leading to complex heating and chemical resistance requirements for liquid tin, and risks impurities like tin oxide being mixed into the reservoir when solid tin is supplied.

Innovation Solution

A high temperature plasma raw material supply apparatus that handles solid state materials, eliminating the need for heating mechanisms and chemical resistance, using a rotatable reservoir and supply nozzle to guide solid materials into a load lock unit with a mesh-like supply path to prevent impurities from entering the container.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If liquid tin is supplied to the reservoir to replenish high temperature plasma raw material, then the reservoir can be refilled, but heating mechanisms and chemical resistance treatments are required, increasing device complexity

Engineering Contradiction:
Improveraw material quantityVSAvoidheating mechanism and chemical resistance requirements
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The invention changes the physical state parameter of the tin from liquid to solid. By supplying solid tin instead of liquid tin, the patent eliminates the need for heating mechanisms to maintain liquid state and chemical resistance treatments to prevent erosion, thus resolving the technical contradiction between refilling capability and device complexity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent utilizes phase transition by storing and supplying tin in solid state rather than liquid state. This phase change approach allows the tin to be handled without heating, and the solid tin naturally melts upon contact with the liquid tin in the reservoir, achieving refilling without complex heating systems or chemical resistance requirements

Inventive Principle:
Principle #36Phase transitions

2Device complexity

If solid tin is supplied to the reservoir, then heating mechanisms and chemical resistance treatments are eliminated, but impurities like tin oxide may be mixed into the reservoir

Engineering Contradiction:
Improveheating mechanism and chemical resistance requirementsVSAvoidimpurity contamination
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The invention segments the supply path into distinct functional zones: a supply path unit with holes that acts as a filter, separating the solid tin supply function from the reservoir. The holes in the supply path unit allow tin oxide impurities to fall through while directing solid tin balls to the reservoir, thus resolving the contradiction between simplified device structure and impurity prevention

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The supply path unit with holes serves as an intermediary component between the solid tin supply and the liquid tin reservoir. This intermediary structure filters out tin oxide impurities generated during solid tin handling, allowing the benefits of solid tin supply (simplified device) while preventing the harmful effect (impurity contamination)

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If liquid tin is used in the reservoir, then high temperature plasma can be generated, but the supply path must be heated and chemically resistant, increasing manufacturing complexity

Engineering Contradiction:
Improveplasma generation capabilityVSAvoidheating and chemical resistance requirements
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The invention changes the state parameter of tin in the supply system from liquid to solid, while maintaining liquid tin in the reservoir for plasma generation. This parameter change in the supply path eliminates heating and chemical resistance requirements, resolving the contradiction between plasma generation reliability and manufacturing ease

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for stable and simplified supply of high temperature plasma raw materials, preventing impurities from contaminating the reservoir and ensuring continuous operation of the EUV light source apparatus.

Implementation Method 1

the supply path unit is provided with a hole formed to be smaller than the high temperature plasma raw material in the solid state

Methodology Applied
Scientific EffectGravity: Gravitation

Implementation Method 2

a raw material reservoir unit rotatably arranged and configured to reserve a plurality of high temperature plasma raw materials in a solid state

Methodology Applied
Scientific EffectRotation:

Data Source

PatentUS10609802B2High-temperature plasma raw material supply apparatus and extreme ultra violet light source apparatus
Publication Date: 2020.03.31 USHIO INC
  • US10609802B2 patent drawing
  • US10609802B2 patent drawing
  • US10609802B2 patent drawing

AI summary

Disclosed herein a high temperature plasma raw material supply apparatus capable of appropriately supplying high temperature plasma raw materials in which impurities are suppressed to a reservoir reserving high temperature plasma raw material in a liquid state. A tin filling mechanism includes a raw material reservoir unit rotatably arranged and configured to reserve a plurality of high temperature plasma raw materials in a solid state; a supply nozzle configured to supply the high temperature plasma raw materials to an outside of the raw material reservoir unit; a load lock unit provided between a housing and a chamber; and a supply path unit configured to guide the high temperature plasma raw materials supplied from the supply nozzle to the load lock unit. At least a part of the supply path unit is provided with a hole formed smaller than the high temperature plasma raw material in the solid state.