Substrate Drying via Solidified Sublimation Film for Pattern Protection
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Solution Overview
Problem
Conventional substrate treating methods face challenges due to a narrow process window for treatment liquid conditions, making it difficult to appropriately treat substrates and protect patterns, as the range of conditions for the treatment liquid is severe and hard to manage.
Innovation Solution
A substrate treating method involving a treatment liquid with a sublimable substance having a vapor pressure of 0.1 Pa to 1.0 Pa at normal temperatures, which forms a solidified film that sublimates, expanding the process window and allowing for easier substrate drying while protecting patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional treatment liquid conditions are used, then substrate treatment is achieved, but the process window is narrow and difficult to manage
Solution Approach 1:
The invention changes the key parameter of the sublimable substance from high vapor pressure (>1.0 Pa) to low vapor pressure (0.1-1.0 Pa) at normal temperatures. This parameter change expands the process window for treatment liquid conditions, making it easier to manage while maintaining reliable substrate treatment and pattern protection.
Solution Approach 2:
The invention utilizes the phase transition (sublimation) of a substance with specifically controlled vapor pressure characteristics. By selecting a sublimable substance with vapor pressure of 0.1-1.0 Pa at normal temperatures, the treatment liquid forms a solidified film that sublimes under controlled conditions, providing both effective drying and pattern protection with a wider process window.
2Manufacturing precision
If treatment liquid conditions are strictly controlled, then pattern protection is achieved, but the conditions are severe and hard to manage
Solution Approach 1:
The invention changes the vapor pressure parameter of the sublimable substance to 0.1-1.0 Pa at normal temperatures, which fundamentally alters the treatment liquid's behavior. This change maintains effective pattern protection through controlled sublimation while significantly easing the management and control requirements for the treatment liquid conditions.
3Speed
If high vapor pressure sublimable substance is used, then sublimation occurs quickly, but the process window becomes narrow
Solution Approach 1:
The invention optimizes the vapor pressure parameter to a specific range (0.1-1.0 Pa at normal temperatures) rather than using high vapor pressure substances. This optimized parameter provides balanced performance: sufficient sublimation speed for effective drying while maintaining a wide process window that enhances adaptability and ease of control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively expands the process window for treatment liquid conditions, making it easier to appropriately dry substrates and protect patterns by using a sublimable substance like 4-tert-butylphenol or acetophenone oxime with isopropyl alcohol, ensuring a wider range of conditions for successful substrate treatment.
Implementation Method 1
the solvent evaporates from the treatment liquid on the substrate, and a solidified film is formed on the substrate
Implementation Method 2
the solidified film sublimates. The solidified film changes to gas without being a liquid. The solidified film is removed from the substrate by sublimation of the solidified film. The substrate is dried by sublimation of the solidified film
Data Source
AI summary
The present invention relates to a substrate treating method, a substrate treating apparatus, and a treatment liquid. The substrate treating method includes the treatment liquid supply step, the solidified film forming step, and the sublimation step. In the treatment liquid supply step, the treatment liquid is supplied to a substrate. The treatment liquid contains a sublimable substance and a solvent. In the solidified film forming step, the solvent evaporates from the treatment liquid on the substrate. In the solidified film forming step, a solidified film is formed on the substrate. The solidified film contains the sublimable substance. In the sublimation step, the solidified film sublimates. The substrate is dried by sublimation of the solidified film. The sublimable substance has a vapor pressure at normal temperatures of 0.1 Pa or more and 1.0 Pa or less.