Soluble Imide Resin for Low Expansion Electrical Laminates
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Solution Overview
Problem
Existing resin compositions for electrical laminates, such as printed wiring boards, face challenges in achieving a low coefficient of linear expansion like polyimide resins while maintaining processability and solubility in common organic solvents, as epoxy resins have higher expansion coefficients and polyimide resins are difficult to process due to low solubility in common solvents.
Innovation Solution
A soluble imide skeleton resin with a specific chemical structure, represented by general formula (1), which has a solubility of 1% by weight or more in cyclohexanone at 60°C, and a cured product with a glass transition temperature of 130°C or more and a coefficient of linear expansion of less than 75 ppm/°C, achieved by reacting divalent phenol compounds with epihalohydrin in the presence of an alkaline, and blending with a curing agent and accelerator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If polyimide resin is used to achieve low coefficient of linear expansion, then the coefficient of linear expansion is reduced, but processability deteriorates due to low solubility in common solvents
Solution Approach 1:
The patent modifies the chemical structure of imide skeleton compounds by introducing specific substituents and combining them with epoxy resin structures, changing the solubility parameters to enable dissolution in common organic solvents while preserving the low linear expansion coefficient characteristic of polyimide resins
Solution Approach 2:
The invention creates a composite material system by combining imide skeleton structures with epoxy resin, achieving a synergistic effect where the cured product exhibits both the low coefficient of linear expansion of polyimide and the excellent processability and solubility of epoxy resin
2Ease of manufacture
If epoxy resin is used to improve processability and solubility, then processability is improved, but the coefficient of linear expansion increases
Solution Approach 1:
The patent develops a composite resin system where imide skeleton compounds are integrated into the epoxy resin structure, creating a material that combines the processability advantages of epoxy with the low linear expansion properties of imide/polyimide structures
Solution Approach 2:
The invention introduces imide skeleton units at specific positions within the resin molecule (as represented by the general formula), creating local regions with low linear expansion characteristics while maintaining the overall epoxy resin matrix that provides good processability
3Stability of the object's composition
If conventional imide skeleton compounds are used to achieve low coefficient of linear expansion, then the coefficient of linear expansion is reduced, but solubility deteriorates as they dissolve only in polar solvents
Solution Approach 1:
The patent changes the solubility parameters of imide skeleton compounds by modifying their chemical structure according to the general formula, enabling them to dissolve in common organic solvents including non-polar and weakly polar solvents, thereby expanding the range of usable solvents while maintaining low linear expansion properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The soluble imide skeleton resin composition offers high heat resistance, low linear expansion, and excellent processability, making it suitable for electrical laminate applications, particularly in printed wiring boards, with improved solubility in ketone solvents and dimethylacetamide.
Implementation Method 1
a soluble imide skeleton resin with a specific chemical structure, represented by general formula (1), which has a solubility of 1% by weight or more in cyclohexanone at 60°C, and improved solubility in ketone solvents and dimethylacetamide
Implementation Method 2
a cured product with a glass transition temperature of 130°C or more and a coefficient of linear expansion of less than 75 ppm/°C, achieved by reacting divalent phenol compounds with epihalohydrin in the presence of an alkaline, and blending with a curing agent and accelerator
Data Source
AI summary
An imide skeleton resin represented by the following general formula (1) has a coefficient of linear expansion as low as that of polyimide resin and excellent processability like epoxy resin, and is useful as a resin composition for electrical laminates. Five percent by mole or more of the entirety of the A component is a linking group having an imide skeleton represented by the following general formula (4-1). B denotes a hydrogen atom or a group represented by the following structural formula (5). n denotes an integer in the range of 0 to 200. If both of the B's are hydrogen atoms, then n denotes an integer of 1 or more.