Component Mount Board with Soluble-Layer Liquid Sensing
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Solution Overview
Problem
Existing component mount boards lack reliability in sensing their state when soaked in liquid, particularly due to breakage, cracking, or dissolving of conductive patterns under moisture exposure.
Innovation Solution
A component mount board design featuring a soluble layer and a second conductive pattern that is soluble or weakened by liquid, with a missing portion in the base allowing the conductive patterns to be connected over the soluble layer, ensuring structural integrity and reliable detection of liquid exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional component mount board uses standard conductive patterns on a solid base, then the board provides structural support and electrical connectivity, but the conductive patterns are prone to breakage, cracking, or dissolving when exposed to liquid, reducing sensing reliability
Solution Approach 1:
The base is designed with a missing portion that segments the structure, allowing the soluble layer and second conductive pattern to bridge across the gap. This segmentation enables the conductive patterns to be supported by the soluble layer rather than directly on the base, preventing breakage and cracking when exposed to liquid while maintaining sensing reliability.
Solution Approach 2:
A soluble layer is introduced as an intermediary between the base and the second conductive pattern. This soluble layer provides structural support to the conductive pattern and enables reliable liquid sensing through dissolution or weakening when wet, while the missing portion in the base allows this intermediary layer to function effectively without direct base-conductive pattern contact in the sensing region.
2Reliability
If the base is made solid and continuous, then the board provides uniform structural support, but the conductive patterns cannot be properly connected over the soluble layer without direct base contact, compromising liquid sensing capability
Solution Approach 1:
The base is segmented by introducing a missing portion at the location corresponding to the second conductive pattern. This segmentation removes the direct base-conductive pattern contact in the sensing region, allowing the soluble layer to serve as the primary support and enabling reliable liquid sensing through its dissolution or weakening when wet.
Solution Approach 2:
The base material is extracted (removed) at the specific location where liquid sensing is required, creating a missing portion. This extraction allows the soluble layer and second conductive pattern to be properly positioned and connected without direct base contact, thereby enabling the liquid sensing function while maintaining overall base stability through the remaining continuous portions.
3Reliability
If the second conductive pattern is made soluble or weakened by liquid, then the board can detect liquid exposure through pattern dissolution or weakening, but the pattern becomes more vulnerable to breakage and cracking under normal conditions
Solution Approach 1:
The soluble layer is positioned underneath the second conductive pattern to provide beforehand cushioning and structural support. This support layer protects the soluble/weakenable conductive pattern from mechanical stress and prevents breakage or cracking under normal conditions, while still allowing the pattern to dissolve or weaken when exposed to liquid for accurate detection.
Solution Approach 2:
The board employs composite materials including a soluble layer and a second conductive pattern that is soluble or weakened by liquid. This composite structure combines materials with different properties: the soluble layer provides structural support and liquid sensing, while the second conductive pattern provides electrical connectivity and detection capability, together achieving both durability and accurate liquid detection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability of sensing liquid-soaked states by reducing breakage and cracking of conductive patterns, maintaining circuit properties, and ensuring structural stability against humidity changes.
Implementation Method 1
the soluble layer is soluble in liquid, and the second conductive pattern is soluble in liquid or is weakened when getting wet with liquid
Data Source
AI summary
Provided is a component mount board which includes: a board having a base, a first conductive pattern, a mount component connected to the first conductive pattern, and a soluble layer; and a second conductive pattern, in which the soluble layer is soluble in liquid, and the second conductive pattern is soluble in liquid or is weakened when getting wet with liquid, the base has, in a portion of the base corresponding to the second conductive pattern, a first missing portion the first conductive pattern has a first portion and a second portion separated from the first portion through the first missing portion, the second conductive pattern connects, over the first missing portion, the first and second portions of the first conductive pattern to each other, and a portion of the second conductive pattern at least over the first missing portion is formed on a first surface of the soluble layer.