Soluble Sensor Node Dissolving After Use
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Solution Overview
Problem
The rapid growth of IoT technology has led to the deployment of many sensors with limited operational lifetimes, making their post-use retrieval costly and time-consuming, and leaving them in place poses environmental and security risks.
Innovation Solution
The development of soluble sensors using water-soluble materials and ultra-thin electronics, which dissolve upon exposure to water or other chemicals, minimizing environmental impact and residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If sensors are deployed for remote wireless sensing applications, then sensing coverage and monitoring capability are improved, but operational lifetime is limited and post-use retrieval becomes costly and time-consuming
Solution Approach 1:
The patent applies the disposable principle by designing sensors with soluble substrates and biodegradable packaging that automatically dissolve after their operational lifetime. This eliminates the need for costly and time-consuming retrieval operations, as the sensors decompose naturally in the environment after completing their sensing function.
Solution Approach 2:
The patent utilizes parameter changes by transitioning the sensor components from a stable solid state during operation to a dissolving state after use. The soluble substrate and biodegradable materials change their physical and chemical properties over time, allowing the sensor to naturally decompose without requiring active retrieval mechanisms.
2Ease of manufacture
If sensors are left in place after their useful life, then retrieval costs are avoided, but environmental and information security risks increase
Solution Approach 1:
The sensor is designed as a disposable device with soluble and biodegradable components that automatically decompose after use. This eliminates environmental contamination and information security risks associated with abandoned sensors, while maintaining cost-effective deployment through simplified end-of-life management.
Solution Approach 2:
The patent converts the potential harm of abandoned sensors into a benefit by using soluble substrates and biodegradable materials that transform the sensor from a persistent pollutant into a naturally decomposing substance. The materials that could have caused environmental damage instead provide a safe, self-destructing mechanism that eliminates security and environmental risks.
3Strength
If conventional non-soluble sensor materials are used, then structural integrity and durability are maintained, but environmental impact and residue increase
Solution Approach 1:
The patent applies parameter changes by selecting materials that transition from a structurally intact state during operation to a dissolving state after use. The soluble substrate and biodegradable packaging maintain sufficient structural integrity during the sensor's operational lifetime, then naturally decompose to eliminate environmental residue.
Solution Approach 2:
The sensor employs composite materials combining soluble substrates with ultra-thin semiconductor layers and biodegradable packaging. This composite structure provides the necessary mechanical strength and functionality during operation, while ensuring complete or near-complete decomposition after use to minimize environmental impact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective and environmentally friendly deployment of sensors that dissolve after their useful life, leaving minimal residue and reducing environmental and security risks.
Implementation Method 1
The interconnection board, the power source, and the packaging each include a soluble material and are solvable by water or other chemicals
Data Source
AI summary
A soluble sensor is provided. The soluble sensor includes a soluble handle substrate and a layer of semiconductor material that is disposed on the soluble handle substrate. The layer of semiconductor material includes a plurality of semiconductor devices interconnected to perform a sensing function.