Processing Solution Venting and Charge Measurement for Substrates

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Solution Overview

Problem

Static charge build-up in processing solutions during semiconductor manufacturing can lead to defects such as dielectric breakdown in resist patterns.

Innovation Solution

A substrate processing apparatus and method that includes a trap tank, supply line, vent line, and static charge measurement units using Faraday cups to measure and remove static charge from processing solutions, ensuring they are free of bubbles and particles before application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If processing solution is supplied through a pipe, then the processing solution can be delivered to the substrate, but electrostatic charges are generated in the processing solution due to friction with the pipe

Engineering Contradiction:
Improveprocessing solution deliveryVSAvoidelectrostatic charge generation
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

A ground line is introduced as an intermediary element between the processing solution and ground potential. This ground line provides a controlled path for electrostatic charges to dissipate, preventing charge accumulation while allowing the processing solution to continue flowing through the pipe system for substrate treatment

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The electrostatic charges generated by friction are converted from a harmful factor into a measurable and controllable parameter. By providing a ground line, the charges are directed to ground potential, transforming the harmful electrostatic accumulation into a controlled electrical flow that can be monitored and managed

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If static charge measurement is implemented, then static charge can be detected and removed from processing solution, but the device complexity increases with additional components

Engineering Contradiction:
Improvestatic charge controlVSAvoidapparatus structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The system incorporates self-monitoring capabilities where the ground line and measurement apparatus automatically detect and respond to static charge conditions. The apparatus serves itself by continuously monitoring charge levels and adjusting the ground connection status without requiring external intervention or complex control systems

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The ground line serves multiple functions simultaneously: it acts as both a charge dissipation path and a measurement reference. By merging the grounding function with the measurement function into a single integrated system, the patent reduces overall device complexity while maintaining reliable static charge control

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents static charge build-up in processing solutions, reducing defects and ensuring consistent substrate processing quality by effectively managing electrostatic charges.

Implementation Method 1

a first static charge measurement unit connected to the first vent line to measure a static charge of the processing solution, and including a first Faraday cup and a first static charge measurement unit connected to the first Faraday cup

Methodology Applied
Scientific EffectFaraday cup measurement: Electrostatics

Implementation Method 2

the first static charge measurement unit may be configured to remove static electricity from the processing solution while the processing solution is in contact with the inner cup of the first Faraday cup

Methodology Applied
Scientific EffectElectrostatic discharge: Electrostatic Discharge

Data Source

PatentUS12456637B2Substrate processing apparatus and substrate processing method
Publication Date: 2025.10.28 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US12456637B2 patent drawing
  • US12456637B2 patent drawing
  • US12456637B2 patent drawing

AI summary

A substrate processing apparatus includes a substrate supporter supporting a substrate, and a processing solution supply apparatus configured to supply a processing solution onto the substrate supported on the substrate supporter, wherein the processing solution supply apparatus includes a trap tank storing the processing solution, a supply line connected to the trap tank to supply the processing solution onto the substrate, a first vent line connected to the trap tank to discharge the processing solution including bubbles or gases from the trap tank, and a first static charge measurement unit connected to the first vent line to measure a static charge of the processing solution, and including a first Faraday cup and a first static charge measurement unit connected to the first Faraday cup.