Solvent Blend for Plating Mask Removal
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Solution Overview
Problem
Current methods for removing microcrystalline wax masking materials in plating processes are incomplete and require multiple steps, with perchloroethylene (PERC) vapor phase cleaning being inefficient for complete wax removal.
Innovation Solution
A solvent blend comprising a co-solvent with a higher boiling point and a vapor phase cleaning solvent, such as isopropyl myristate and trans-1,2-dichloroethylene combined with hydrofluoroether, is used to efficiently remove plating masks through a heated solvent blend process, including heating, dipping, and vapor phase cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PERC vapor phase cleaning is used to remove masking wax, then the process is non-flammable and has high boiling point advantages, but the wax removal is incomplete and requires multiple steps
Solution Approach 1:
The patent uses a composite solvent system combining PERC with co-solvents (such as isopropyl myristate, oleic acid, or stearic acid) to create a synergistic cleaning solution. This composite approach allows the mixture to achieve complete wax removal in a single step, overcoming the limitation of PERC alone which required multiple sequential steps (boiling water immersion followed by vapor phase cleaning). The co-solvents enhance the solubility and effectiveness of PERC against microcrystalline wax while maintaining the non-flammable safety advantage.
2Reliability
If multiple cleaning steps are used to remove plating mask, then complete wax removal can be achieved, but the process time and complexity increase
Solution Approach 1:
The patent merges multiple separate cleaning operations (boiling water immersion and PERC vapor phase cleaning) into a single integrated cleaning step using the solvent blend. The heated solvent blend simultaneously performs the functions of both previous steps, eliminating the need for sequential processing. This consolidation reduces total cleaning time while maintaining complete wax removal effectiveness, directly addressing the time loss associated with multi-step processes.
3Reliability
If traditional multi-step cleaning process is used, then thorough wax removal is achieved, but the device complexity and process steps increase
Solution Approach 1:
The solvent blend system serves multiple functions simultaneously: it acts as both a heating medium and a cleaning agent in a single process step. The blend combines the high boiling point advantage of PERC with the enhanced wax-solubilizing properties of co-solvents, creating a universal cleaning solution that eliminates the need for separate water immersion and vapor cleaning systems. This multi-functionality reduces equipment complexity while ensuring thorough wax removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solvent blend effectively removes plating masks in fewer steps, ensuring complete wax removal without the limitations of PERC, while maintaining safety and efficiency.
Implementation Method 1
heating a solvent blend that comprises a co-solvent and a vapor phase cleaning solvent to an elevated temperature to produce a heated solvent blend
Implementation Method 2
the metal substrate is in contact with the vapor produced from the vapor phase cleaning solvent for a second cleaning period
Implementation Method 3
removing the metal substrate from the heated solvent blend and into a cooling zone for a cooling period
Data Source
AI summary
Manufacturers, particularly manufacturers of parts for aerospace applications, may use a plating mask to mask parts when plating. Plating masks may be used to mask a metallic part during etching and plating. After etching and plating, the plating mask needs to be removed. The present disclosure describes a solvent blend for removing a plating mask that comprises a co-solvent and a vapor phase cleaning solvent, wherein the co-solvent has a higher boiling point than the vapor phase cleaning solvent. In some embodiments, the co-solvent comprises isopropyl myristate. In some embodiments, the vapor phase cleaning solvent comprises a mixture of trans-1,2-dichloroethylene and hydrofluoroether.