Solvent Bonding Block Copolymers Medical Devices

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Solution Overview

Problem

Current methods for bonding component parts to polymeric substrates in medical devices, such as UV curable adhesives and over-molding, are time-consuming and expensive, and solvent bonding is not effective for all materials like thermoplastic olefins and block copolymers.

Innovation Solution

Applying a solvent containing a tackifier to the surface of a polymeric substrate or component part made from a block copolymer, allowing the solvent to swell and penetrate, creating a pressure-sensitive bond when the parts are contacted together.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If UV curable adhesive is used to bond component part to polymeric substrate, then bonding strength is achieved, but manufacturing time increases due to UV curing requirement

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing time

Core Design Contradiction:

StrengthVSLoss of time

Solution Approach 1:

The patent replaces UV light curing (electromagnetic energy system) with a mechanical pressing system. The solvent-containing composition is applied to the bonding surface, and simple mechanical pressure is applied to achieve bonding, eliminating the need for UV light sources and curing time while maintaining adequate bonding strength for medical device applications

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding mechanism from photochemical reaction (UV curing) to solvent-based adhesion with mechanical pressure. By using a solvent-containing composition that swells the block copolymer and allows tackifier penetration, the bonding process occurs at room temperature under simple pressure, dramatically reducing manufacturing time while achieving sufficient bond strength

Inventive Principle:

Principle #35Parameter changes

2Strength

If over-molding is used to attach component part to substrate, then adequate bonding is provided, but manufacturing complexity increases due to injection molding tool requirement

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing equipment complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent replaces complex injection molding equipment with a simple solvent-based bonding system. Instead of requiring an injection molding tool to create an over-mold, the process uses application of a solvent-containing composition followed by simple pressing, dramatically reducing equipment complexity while achieving adequate bonding for medical device component attachment

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs a simple, inexpensive bonding composition (solvent + tackifier) that requires minimal equipment infrastructure. This approach replaces expensive, complex injection molding tools with a straightforward chemical-mechanical bonding process that can be implemented with basic application and pressing equipment

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Strength

If solvent bonding is used to bond PVC or polystyrene, then strong bonds are formed, but the method is not effective for thermoplastic olefins and block copolymers

Engineering Contradiction:

Improvebond strengthVSAvoidmaterial compatibility

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent creates a composite bonding system combining a solvent (to swell the block copolymer) with a tackifier (to provide adhesion). This composite composition is specifically designed to work with thermoplastic olefins and block copolymers, extending solvent bonding capability to materials that were previously incompatible with this method while maintaining strong bond formation

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent modifies the solvent bonding approach by adding a tackifier component to the solvent system. This parameter change in the bonding composition enables the process to work with block copolymers and thermoplastic olefins, significantly expanding material compatibility while maintaining the strong bonds characteristic of solvent bonding

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables quick and strong bonding of medical device components, with bond strengths exceeding 40 N, which can improve after radiation sterilization, allowing for faster manufacturing processes and suitable for materials previously unsuitable for solvent bonding.

Implementation Method 1

applying a solvent containing a tackifier to a surface of at least one of a polymeric substrate or a component part... allowing the solvent to swell and penetrate

Methodology Applied

Scientific EffectSwelling:

Implementation Method 2

applying a solvent containing a tackifier to a surface of at least one of a polymeric substrate or a component part

Methodology Applied

Scientific EffectSolvation: Solvation

Implementation Method 3

creating a pressure-sensitive bond when the parts are contacted together

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11666729B2Methods of bonding components to polymeric substrates

Publication Date: 2023.06.06 HOLLISTER INCORPORAED

AI summary

Methods for bonding polymeric substrates to component parts, and medical devices assemblies including a tubing and a component part bonded together using a solvent containing a tackifier.