Solvent-Free One-Component Isocyanate Curing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing one-component isocyanate compositions face challenges with slow curing speeds and the need for additional components or moisture, which are undesirable in applications like the electronics industry where rapid bonding and coating are required.

Innovation Solution

Development of heat-curing, solvent-free one-component compositions using latent hardeners that solidify at room temperature but react and crosslink with isocyanates upon heating, eliminating the need for a second component and moisture, with specific examples including polycyanates and polyisocyanates reacting with nitrogen-containing latent hardeners.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If moisture curing is used for one-component isocyanate compounds, then curing can proceed without additional components, but the curing progress is slow and depends on humidity levels

Engineering Contradiction:
Improvecuring without additional componentsVSAvoidcuring speed
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The patent uses blocked isocyanates where the isocyanate groups are chemically modified to be dormant at room temperature but become active at elevated temperatures (typically 80-160°C). This parameter change from moisture-dependent to temperature-dependent activation enables rapid curing without being limited by humidity levels, while still maintaining one-component simplicity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the moisture-based chemical activation mechanism with a thermally activated mechanism. Instead of relying on water molecules to trigger the reaction, heat energy activates the blocked isocyanate groups, substituting a controllable thermal process for an environmentally dependent moisture process

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If heat curing with blocked isocyanates is used, then curing speed can be improved, but curing times of 15 minutes at 150°C are too long for critical applications

Engineering Contradiction:
Improvecuring speedVSAvoidcuring time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent employs specific blocking agents that deblock at lower temperatures compared to conventional blocked isocyanates. By changing the blocking chemistry to use agents like oximes, phenols, or specific carbamates with lower decomposition temperatures, the curing process activates more rapidly at reduced temperature thresholds, significantly shortening cure times

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates composite formulations combining isocyanates with specific latent hardeners that have complementary thermal properties. The latent hardener remains inactive during storage but becomes highly reactive at curing temperatures, creating a synergistic effect that accelerates the overall curing process beyond what conventional blocked isocyanates alone can achieve

Inventive Principle:
Principle #40Composite materials

3Reliability

If two-component polyurethane compounds are used, then curing performance can be improved, but the mixing process is undesirable in electronics applications

Engineering Contradiction:
Improvecuring performanceVSAvoidmixing process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the isocyanate component and hardener component into a single stable formulation using blocked isocyanate technology. The blocking agent prevents premature reaction during storage and handling, allowing both reactive components to coexist in one container without mixing, eliminating the complexity of two-component systems while maintaining the curing performance of reacted polyurethane networks

Inventive Principle:
Principle #5Merging (Combining)

4Stability of the object's composition

If latent hardeners with high melting points are used, then storage stability is improved, but the curing rate is determined by slow deblocking

Engineering Contradiction:
Improvestorage stabilityVSAvoidcuring rate
Core Design Contradiction:
Stability of the object's compositionVSProductivity

Solution Approach 1:

The patent selects latent hardeners and blocking agents with carefully optimized melting and deblocking temperatures in the range of 80-160°C. This parameter optimization ensures that the hardener remains solid and stable during storage at room temperature but melts and becomes sufficiently reactive at curing temperatures to achieve rapid cure rates, balancing storage stability with curing speed

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

These compositions achieve rapid curing times, often under 30 seconds at 150°C, while maintaining excellent storage stability, making them suitable for high-volume, time-sensitive applications in electronics and other industries.

Implementation Method 1

latent hardeners that solidify at room temperature but react and crosslink with isocyanates upon heating

Methodology Applied
Scientific EffectPhase transition (melting): Melting

Implementation Method 2

trigger a polyaddition and crosslinking reaction between the hardener and the (iso)cyanate

Methodology Applied
Scientific EffectChemical reaction (polyaddition and crosslinking): Chemical Bonding

Data Source

PatentEP1899431B2Thermosetting solvent-free single-component substances and use thereof
Publication Date: 2015.12.30 DELO INDUSTRIE KLEBSTOFFE GMBH & CO KG
  • EP1899431B2 patent drawingFigure 1~2
  • EP1899431B2 patent drawingFigure 3

AI summary

Disclosed is a thermosetting, solvent-free single-component substance that has a minimum shelf life of 2 weeks at ambient temperature and is composed of (A) 5 to 90 parts by weight of an at least bifunctional (iso)cyanate component, (B) 5 to 50 parts by weight of a latent hardener which is solid up to a temperature of at least 40 °C and is based on nitrogen compounds suitable for addition-crosslinking, (C) 0 to 50 parts by weight of an epoxy-containing compound, D) 0 to 50 parts by weight of modifiers, the sum of all parts by weight amounting to 100. Also disclosed is the use of said substance for gluing, pouring, sealing, and coating substrates, particularly of electronic components. The inventive substance is cured within seconds at 120 to 150 °C.