Solvent-Free Polyimide Formulations for Rapid 3D Inkjet Printing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current additive manufacturing techniques, particularly in 3D inkjet printing, face limitations in using polyimides due to their long solidification time and inferior properties compared to neat polyimides.

Innovation Solution

A method of additive manufacturing that employs a solvent-free polyimide-containing formulation, comprising a polyimide precursor and a multifunctional curable material, which are combined without the need for organic solvents or bis-allyl-nadi-imide compounds, and cured under specific conditions to form a thermosetting polyimide material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional polyimide formulations are used in additive manufacturing, then the material can be deposited, but the solidification time is long and the properties are inferior compared to neat polyimides

Engineering Contradiction:
Improvematerial propertiesVSAvoidsolidification time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent changes the chemical composition parameters of the formulation by using polyimide precursors (polyamic acid or polyamic ester) instead of conventional polyimide formulations. This parameter change enables the material to cure rapidly while achieving properties comparable to neat polyimides, thus resolving both the solidification time and material properties contradiction

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent utilizes the phase transition from liquid precursor to solid cured polyimide through controlled chemical reactions (hydrolysis and imidization). This phase transition mechanism allows rapid solidification while maintaining high material properties, addressing both the time and reliability concerns

Inventive Principle:
Principle #36Phase transitions

2Reliability

If solvent-free formulations are used, then the thermal and mechanical properties are improved, but the processing complexity increases

Engineering Contradiction:
Improvethermal and mechanical propertiesVSAvoidprocessing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces polyimide precursors (polyamic acid or polyamic ester) as intermediary substances that facilitate the transition from liquid state to cured polyimide state. These precursors act as mediators that enable solvent-free processing while maintaining simple formulation composition and achieving superior thermal and mechanical properties

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent performs preliminary chemical synthesis to create polyimide precursors with built-in reactivity. These precursors are pre-formulated to undergo controlled hydrolysis and imidization reactions during the additive manufacturing process, eliminating the need for complex post-processing steps and reducing overall processing complexity

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the rapid solidification of polyimide layers, improving the thermal and mechanical properties of the resulting material, and allows for the creation of complex structures with enhanced performance.

Implementation Method 1

exposing each of the dispensed layers to a curing condition to thereby form a cured modeling material comprising the polyimide-containing material

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Implementation Method 2

exposing each of the dispensed layers to a curing condition to thereby form a cured modeling material comprising the polyimide-containing material

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS12291603B2Additive manufacturing employing solvent-free polyimide-containing formulations
Publication Date: 2025.05.06 STRATASYS LTD
  • US12291603B2 patent drawing
  • US12291603B2 patent drawing
  • US12291603B2 patent drawing

AI summary

Formulations usable in additive manufacturing, 3D inkjet printing in particular, of a three-dimensional object that contains a polyimide material, and additive manufacturing utilizing same are provided. The formulations contain a polyimide precursor (e.g., a bismaleimide) and an additional curable material, which is a multifunctional curable material, and are devoid of an organic solvent.