Solvent Jet Edge Stripping for Irregular Wafer Contours
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for removing coatings from substrates, particularly in edge areas, are time-consuming and inefficient, often resulting in damage to the substrate or incomplete removal, especially when dealing with irregularly shaped substrates like round wafers with flats or notches.
Innovation Solution
A device comprising a nozzle for delivering a solution medium jet guided by compressed air, a suction device for recycling the solution, and a system for aligning and rotating the substrate to precisely remove coatings from edge regions without damaging the substrate, allowing for the removal of coatings along complex contours.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a washing nozzle is used to dispense liquid medium for coating removal, then the coating can be removed from the substrate, but the substrate may be damaged and the process is time-consuming
Solution Approach 1:
The device segments the coating removal process by using multiple nozzles arranged in a specific pattern, with each nozzle targeting specific areas of the substrate. This allows precise control over which areas are treated and at what intensity, preventing damage to the entire substrate while effectively removing coating from target regions.
Solution Approach 2:
The invention applies local quality by directing the liquid medium only to specific areas of the substrate where coating removal is needed, rather than treating the entire substrate uniformly. The nozzle arrangement and movement system ensure that the liquid medium is applied locally to edge regions and other specific areas, preventing damage to areas that don't require coating removal.
2Productivity
If conventional coating removal methods are used, then coating can be removed from substrates, but the process is time-consuming and inefficient
Solution Approach 1:
The device achieves continuous useful action by implementing a systematic nozzle arrangement and movement system that continuously applies liquid medium to the substrate surface. The nozzles are positioned and moved in coordination to ensure uninterrupted coating removal across the entire substrate, eliminating idle time and maximizing productivity throughout the processing cycle.
Solution Approach 2:
The invention incorporates dynamics by making the nozzle system movable and adjustable. The nozzles can be positioned and repositioned dynamically to adapt to different substrate sizes, shapes, and coating removal requirements. This dynamic capability allows the system to optimize the coating removal process for each specific application, significantly reducing processing time compared to static conventional methods.
3Manufacturing precision
If the nozzle is guided close to or far from the substrate edge, then the width of the area to be removed can be controlled, but precise control is difficult to achieve
Solution Approach 1:
The device implements feedback control through a system that monitors the position of the nozzles relative to the substrate edge and automatically adjusts the nozzle movement or positioning. This feedback mechanism ensures that the desired width of the area to be removed is achieved with high precision, eliminating the difficulty of manual positioning control and ensuring consistent results across different operations.
Solution Approach 2:
The invention replaces manual mechanical positioning with an automated control system that uses sensors, actuators, and control algorithms to position and move the nozzles. This substitution of mechanical manual operation with automated control systems provides precise and repeatable positioning, making it easy to control the width of the area to be removed without the difficulties associated with manual mechanical adjustment.
4Manufacturing precision
If solvent medium is dispensed for coating removal, then the coating can be completely removed, but the solvent enters the environment and cannot be recycled
Solution Approach 1:
The device implements discarding and recovering by capturing the solvent medium after it has been used for coating removal and recycling it for subsequent operations. The system includes collection mechanisms that capture the solvent, separate any removed coating material, and return the purified solvent to the dispensing system. This closed-loop approach eliminates solvent loss to the environment while maintaining complete coating removal effectiveness.
Solution Approach 2:
The invention applies self-service by designing a system that automatically recycles its own solvent medium without requiring external intervention. The captured solvent is automatically processed and reused in the coating removal process, making the system self-sufficient and eliminating the need for continuous fresh solvent supply. This self-service capability both prevents environmental contamination and eliminates substance loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and efficient removal of coatings from substrates with irregular shapes by using a combination of a solution medium jet and compressed air, ensuring complete removal without substrate damage and allowing for the recycling of the solution medium.
Implementation Method 1
the nozzle is designed to dispense the solvent jet in such a way that it is guided within a compressed air stream
Implementation Method 2
the device includes a suction unit. This offers the advantage that the solvent medium that rebounds from the substrate does not enter the environment but can be extracted
Implementation Method 3
an impact wall is used as the condenser. According to the invention, the impact wall is suitable for at least partially condensing the extracted medium
Implementation Method 4
the extracted medium is directed onto the impact wall and abruptly decelerated there. This causes the medium to condense
Data Source
Figure 1
Figure 2
Figure 3
AI summary
In a device (1) for removing a coating, in particular photoresist, from a substrate (10) in at least one area of the substrate (10), a nozzle (11) shall be suitable for dispensing a jet of a solvent medium.