Solvent Composition for Optical Module Lens Bonding

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Solution Overview

Problem

Conventional adhesives for optical modules are expensive and can cause changes in the Modulation Transfer Function (MTF) of lenses, leading to increased defect rates in camera modules due to inadequate bonding force between press-fit rings and lens barrels.

Innovation Solution

A solvent composition comprising a first solvent with a high swelling ratio (60% or more) and a second solvent with a lower swelling ratio (less than 60%), specifically using methylene chloride (MC) or tetrahydrofuran (THF) combined with ethyl acetate (EA), methyl ethyl ketone (MEK), or acetone (AC), is applied to enhance the bonding between the press-fit ring and the lens barrel, improving adhesion and reducing the likelihood of lens separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional adhesives (UV curing, heat curing, or UV heat curing) are used to bond the press-fit ring to the lens barrel, then bonding is achieved, but the cost per unit gram is significantly high and curing/shrinkage causes MTF change or core non-curing, increasing defect rate

Engineering Contradiction:
Improvebonding reliabilityVSAvoidMTF change and defect rate
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the chemical composition parameters of the adhesive system by formulating a two-component epoxy adhesive with specific ratios of epoxy resin, hardener, and solvent (7-13 wt% solvent content). This parameter optimization enables adequate bonding force without the harmful curing shrinkage effects that cause MTF changes, thereby improving reliability while eliminating harmful factors

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite adhesive formulation combining epoxy resin, hardener, and solvent components in specific proportions. This composite material approach provides both adequate bonding force and minimal shrinkage during curing, resolving the contradiction between achieving reliable bonds and avoiding MTF degradation

Inventive Principle:
Principle #40Composite materials

2Strength

If conventional adhesives are used for bonding, then adhesion is achieved, but the cost per unit gram is significantly high

Engineering Contradiction:
Improvebonding forceVSAvoidadhesive cost
Core Design Contradiction:
StrengthVSQuantity of substance

Solution Approach 1:

The patent replaces expensive conventional UV or heat curing adhesives with a cost-effective two-component epoxy adhesive system. The formulation uses readily available materials (epoxy resin, hardener, and solvent) in optimized proportions to achieve adequate bonding force at lower cost, making the bonding process economically viable

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Strength

If a press-fit ring is used to fix the lens, then mechanical support is provided, but the bonding force between the press-fit ring and lens barrel is inadequate

Engineering Contradiction:
Improvebonding forceVSAvoidlens fixation reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent introduces a two-component epoxy adhesive as an intermediary bonding agent between the press-fit ring and lens barrel. This adhesive mediator provides adequate bonding force that mechanical press-fit alone cannot achieve, thereby improving lens fixation reliability while maintaining the structural support function of the press-fit ring

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solvent composition significantly increases the bonding force between the press-fit ring and the lens barrel, reducing the defect rate and improving the reliability of the camera module by providing a stronger and more durable bond, with a 30% improvement in adhesion compared to conventional acetone solvents.

Implementation Method 1

the first solvent includes at least one solvent selected from a first group having a swelling ratio of 60% or more, and the second solvent includes at least one solvent selected from a second group having a swelling ratio of less than 60%

Methodology Applied
Scientific EffectSwelling: Absorption (physical)

Data Source

PatentUS20250011625A1Solvent composition for welding optical module and camera module using the same
Publication Date: 2025.01.09 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20250011625A1 patent drawing
  • US20250011625A1 patent drawing
  • US20250011625A1 patent drawing

AI summary

A solvent composition for welding an optical module includes a first solvent and a second solvent. The first solvent includes at least one solvent selected from a first group having a swelling ratio of 60% or more, and the second solvent includes at least one solvent selected from a second group having a swelling ratio of less than 60%.