Solventless Acrylic Film Composition for Uniform Thickness

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Solution Overview

Problem

Conventional methods for manufacturing pressure-sensitive adhesive films often result in non-uniform thickness and physical property variations along the axis direction, leading to issues like 'fish eye' protrusions and inadequate optical transparency.

Innovation Solution

A solventless composition comprising a (meth)acrylic polymer component with a photoreactive group, a monomer component with high glass transition temperature, and a multifunctional acrylate or acrylate-based oligomer, which is cured to achieve a uniform film with enhanced optical and physical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a thermoplastic resin is melted and applied using conventional extrusion or calendaring methods, then the substrate film can be manufactured, but projecting parts called fish eyes are frequently formed and the film has non-uniform thickness

Engineering Contradiction:
Improvefilm thickness uniformityVSAvoidconventional processing complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The invention changes the physical state parameter of the composition from liquid/melted state to solidifiable photopolymerizable state. The composition is applied in a partially polymerized state and then cured by UV irradiation, eliminating the need for melting and conventional processing, thereby achieving uniform thickness without fish eyes

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention utilizes phase transition from liquid composition to solid film through photopolymerization. The composition transitions from a flowable state during application to a rigid cured state after UV irradiation, enabling precise thickness control and eliminating defects associated with thermal processing

Inventive Principle:
Principle #36Phase transitions

2Stability of the object's composition

If conventional extrusion or calendaring methods are used to manufacture the substrate film, then the film can be produced, but significant variation in physical properties occurs according to the axis direction

Engineering Contradiction:
Improvephysical property uniformityVSAvoidconventional manufacturing process
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The invention changes the processing parameter from thermal melting to photopolymerization curing. This eliminates directional flow patterns inherent in extrusion and calendaring, resulting in uniform physical properties in all directions since the composition cures in place without directional movement

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention achieves homogeneous composition and properties throughout the film by applying the photopolymerizable composition uniformly and curing it through UV irradiation. The crosslinking reaction occurs uniformly across the entire film, eliminating the anisotropy and property variations caused by conventional directional processing methods

Inventive Principle:
Principle #33Homogeneity

3Ease of operation

If a solventless composition with low glass transition temperature polymer component is used, then the composition remains flexible during processing, but the cured product may have insufficient thermal resistance

Engineering Contradiction:
ImproveprocessabilityVSAvoidthermal resistance
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

The invention creates a composite polymer system combining low Tg (meth)acrylic polymer for flexibility and processability with high Tg monomer components for thermal resistance. The synergistic combination allows the composition to remain workable during application while achieving the required thermal performance in the cured state

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention changes the glass transition temperature parameter of the final cured product by combining polymers and monomers with different Tg values. The crosslinking density and composition ratio are adjusted to achieve the target Tg of -20°C or higher, balancing processability and thermal resistance

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solventless composition enables the production of films with uniform thickness, improved optical transparency, and enhanced physical properties, such as thermal resistance, while preventing contamination and gelation, making it suitable for applications like semiconductor wafer processing.

Implementation Method 1

a photoinitiator, and wherein the (meth)acrylic polymer component has a low glass transition temperature, and as a solventless composition for manufacturing a film in a partially polymerized state

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentEP2676975B1Solventless composition and method for preparing same
Publication Date: 2018.06.13 LG CHEM LTD
  • EP2676975B1 patent drawing
  • EP2676975B1 patent drawing
  • EP2676975B1 patent drawing

AI summary

Provided are a solventless composition and a method of preparing the same. Here, the solventless composition may effectively manufacture a film that is uniform without substantial deviation in thickness and has a large but uniform thickness or an excellent physical property such as thermal resistance during manufacture of a film. In addition, the composition of the present invention does not induce contamination during the manufacture of the film. Furthermore, by preventing gelation or phase separation of components of the composition, the composition capable of manufacturing a substrate film having an excellent physical property such as optical transparency, thermal resistance and dimension stability may be provided.