Solvent-less Adhesive Composition for Food Packaging
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Solution Overview
Problem
Traditional solvent-based laminates require an oven-drying step, which is costly and inefficient, and solvent-less laminates with poor adhesion after chemical aging or high-temperature testing are unsuitable for applications like food packaging, leading to defects such as bubbling and delamination.
Innovation Solution
A two-component solvent-less adhesive composition is developed, comprising the reaction product of an isocyanate component and a polyol component, specifically including dimer acid polyester polyols, which provides sufficient adhesion after exposure to heat and food products without the need for oven-drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solvent-based adhesives are used to form laminates, then adhesion strength is improved, but additional drying equipment and processing costs are required
Solution Approach 1:
The patent extracts and eliminates the solvent component from the adhesive system, transitioning from solvent-based adhesives to solvent-less adhesives. This removal of the solvent eliminates the need for drying equipment and processing while maintaining adhesive functionality through the reaction product of isocyanate and polyol components.
Solution Approach 2:
The patent changes the fundamental parameter of solvent content from present to absent, and alters the adhesive mechanism from physical bonding to chemical bonding through the reaction product formation. This parameter change enables the adhesive to cure without solvent evaporation, eliminating drying requirements.
2Ease of manufacture
If solvent-less adhesives are used to eliminate drying steps, then processing cost is reduced, but adhesion deteriorates after chemical aging and high temperature testing
Solution Approach 1:
The patent creates a composite adhesive system combining isocyanate component with specific polyol components (dimer acid polyester polyol and optionally polyether polyol or polyester polyol). This composite formulation provides both the solvent-less processing advantage and the chemical resistance needed for reliable adhesion after aging and high-temperature testing.
Solution Approach 2:
The patent modifies the chemical composition parameters of the solvent-less adhesive by incorporating dimer acid polyester polyol and optionally polyether polyol or polyester polyol. These compositional changes enhance the adhesive's chemical resistance and thermal stability, improving reliability after aging and high-temperature exposure.
3Use of energy by moving object
If solvent-less adhesives are used to avoid oven-drying, then energy consumption is reduced, but laminate defects such as bubbling and delamination occur
Solution Approach 1:
The patent extracts the solvent component that causes bubbling and delamination issues during and after drying. By using a solvent-less adhesive system, the source of these defects is eliminated, allowing energy-efficient processing without compromising laminate quality.
Solution Approach 2:
The patent employs a composite adhesive formulation with isocyanate reacting with dimer acid polyester polyol and optionally polyether polyol or polyester polyol. This composite system provides controlled curing that prevents defects while maintaining low energy consumption by eliminating the high-temperature oven-drying step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition ensures strong and durable bonds, preventing delamination and maintaining integrity during boil-in-bag tests, thus addressing the limitations of existing solvent-less laminates in food packaging applications.
Implementation Method 1
the reaction product of (A) an isocyanate component containing the reaction product of (i) an isocyanate monomer and (ii) a first dimer acid polyester polyol; and (B) a polyol component containing (i) a second dimer acid polyester polyol
Data Source
AI summary
The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component containing the reaction product of (i) an isocyanate monomer and (ii) a first dimer acid polyester polyol; and (B) a polyol component containing (i) a second dimer acid polyester polyol and (ii) optionally, a polyol selected from a polyether polyol, a polyester polyol, and combinations thereof. The two-component solvent-less adhesive composition contains from 15 wt % to 45 wt % units derived from dimer acid, based on the total weight of the two-component solvent-less adhesive composition.