Solvent-less Adhesive Composition for Heat-Resistant Laminates

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Solution Overview

Problem

Solvent-less adhesives used in laminates often exhibit poor adhesion after chemical aging and high-temperature testing, leading to defects such as bubbling and delamination, making them unsuitable for applications like food packaging and deep-drawn cans that require sustained adhesion.

Innovation Solution

A two-component solvent-less adhesive composition is developed, comprising the reaction product of an isocyanate component and a polyol component containing a polyester-amide polycarbonate polyol, which is formed by reacting the polyol and isocyanate components to create a robust adhesive bond.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If solvent-less adhesives are used to form laminates, then the adhesive composition is simplified and environmental concerns are reduced, but the adhesion strength deteriorates after chemical aging and high temperature testing

Engineering Contradiction:
Improveadhesive composition simplicityVSAvoidadhesion strength after chemical aging and heat exposure
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent employs a composite adhesive system comprising multiple polyol components (polyester polyol, polycarbonate polyol, and polyester-amide polycarbonate polyol) combined with an isocyanate component. This multi-component polyol formulation creates a composite adhesive material that maintains simplicity in application (solvent-less) while achieving superior adhesion retention after chemical aging and high-temperature testing through the synergistic effects of different polyol types.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the chemical composition parameters of the polyol component by incorporating polyester-amide polycarbonate polyol with specific molecular weight ranges (number average molecular weight of 500-5000 g/mol) and controlled hydroxyl numbers. These parameter changes in the adhesive formulation enable the system to maintain adhesion strength after exposure to harsh conditions while remaining solvent-less.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If conventional solvent-less adhesives are used, then the formulation is simpler, but the laminate exhibits defects such as bubbling and delamination after exposure to heat and chemicals

Engineering Contradiction:
Improveadhesive formulation complexityVSAvoidlaminate defects (bubbling and delamination)
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The adhesive formulation uses a composite of multiple polyol types (polyester, polycarbonate, and polyester-amide polycarbonate) with the isocyanate component. This composite approach creates a more robust adhesive system that prevents laminate defects like bubbling and delamination after heat and chemical exposure, while keeping the formulation practical for industrial application.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The polyester-amide polycarbonate polyol acts as an intermediary component that bridges the adhesive properties and thermal/chemical resistance requirements. This intermediate polymer structure with specific molecular weight and hydroxyl number characteristics mediates between the isocyanate crosslinking system and the final laminate performance, preventing defect formation under harsh conditions.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adhesive composition maintains strong adhesion after exposure to heat and chemicals, preventing defects like bubbling and delamination, and demonstrates improved performance in boil-in-bag and chemical aging tests.

Implementation Method 1

the reaction product of (A) an isocyanate component and (B) a polyol component containing a polyester-amide polycarbonate polyol

Methodology Applied
Scientific EffectPolymerization reaction: Chemical Bonding

Data Source

PatentUS12054652B2Two-component solvent-less adhesive composition
Publication Date: 2024.08.06 ARKEMA FRANCE SA
  • US12054652B2 patent drawing
  • US12054652B2 patent drawing
  • US12054652B2 patent drawing

AI summary

The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component and (B) a polyol component containing a poly-ester-amide polycarbonate polyol. The present disclosure also provides a method of forming a two-component solvent-less adhesive composition.