Solventless Encapsulation Film for OLED Moisture Barrier
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Solution Overview
Problem
The durability of organic electronic devices, such as OLEDs, is compromised due to the easy oxidation of organic materials and metal electrodes by external factors like moisture, necessitating an encapsulation film with enhanced moisture barrier properties.
Innovation Solution
A solventless method for manufacturing an encapsulation film is developed, involving the single-step mixing of an encapsulation resin and a moisture adsorbent, followed by extrusion at high temperature and pressure to achieve uniform dispersion and improved compatibility of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional multi-layer encapsulation structure with separate adhesives is used, then moisture barrier properties can be achieved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent combines the encapsulation resin and moisture adsorbent into a single integrated encapsulation layer, eliminating the need for separate adhesive layers and multiple manufacturing steps. This merging of functions achieves both moisture barrier properties and structural encapsulation in one layer, directly reducing device complexity while maintaining reliability.
Solution Approach 2:
The encapsulation layer is designed to perform multiple functions simultaneously: it provides mechanical encapsulation, moisture barrier protection, and stress absorption through the integrated structure of encapsulation resin and moisture adsorbent. This multi-functionality eliminates the need for separate specialized layers, reducing overall device complexity.
2Reliability
If multiple layers and additional adhesives are used to ensure moisture blocking, then reliability improves, but manufacturing time and process complexity increase
Solution Approach 1:
By merging the encapsulation resin and moisture adsorbent into a single mixed composition that forms one integrated layer, the patent reduces the number of manufacturing steps. The single-step mixing process eliminates sequential layer deposition and adhesive application steps, significantly reducing manufacturing time while maintaining long-term reliability through the unified structure.
3Ease of manufacture
If solvent-based methods are used for encapsulation film manufacturing, then ease of processing is improved, but residual solvents may harm organic electronic components
Solution Approach 1:
The patent extracts and eliminates the solvent component from the encapsulation composition, using only solid encapsulation resin and moisture adsorbent materials. This extraction of the harmful solvent element eliminates residual solvent damage to organic electronic components while maintaining processing ease through the extrusion of the solid-content composition.
Solution Approach 2:
The patent changes the physical state parameter of the encapsulation composition from liquid (solvent-based) to solid (solvent-free), achieving both ease of manufacture through extrusion and elimination of harmful residual solvents. The high solid content (95-99 wt%) enables direct extrusion without requiring solvent evaporation or curing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in an encapsulation film with excellent moisture barrier and adhesion properties, ensuring long-term reliability of organic electronic devices without the need for multiple layers or additional adhesives.
Implementation Method 1
an encapsulation film with maximized moisture barrier properties is required
Implementation Method 2
a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside
Data Source
AI summary
A method of manufacturing an encapsulation film, the method including preparing a solventless type encapsulation composition by mixing an encapsulation resin and a moisture adsorbent in a single step; and preparing an encapsulation layer by extruding the encapsulation composition at a temperature of 90° C. or more, a method of manufacturing an organic electronic device manufacturing method using same, and provides a method of manufacturing an encapsulation film having a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, and enabling long-term reliability of the organic electronic device to be ensured.