Sonic Wave Sensor Unit Holder Through-Hole Isolation
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Solution Overview
Problem
Existing sonic wave sensor units face interference issues due to sonic wave vibrations propagating within the element-accommodating case and being reflected by its walls, affecting the receiving element's ability to accurately convert vibrations into electrical signals.
Innovation Solution
A sonic wave sensor unit design featuring a transmission side piezoelectric element and a reception side piezoelectric element, with a sealing substrate and a holder having a through hole that positions the reception side vibrating surface inside the holder's wall, minimizing external interference and enhancing mechanical strength, while a viscoelastic adhesive tape is used to fix the sealing substrate to the holder, reducing unwanted vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the receiving element is disposed in the element-accommodating case, then the sonic wave sensor unit can be compactly structured, but the receiving element is adversely affected by sonic wave vibrations propagating in the case or reflected by the wall surface
Solution Approach 1:
The patent divides the receiving element's environment into two separate spaces: the element-accommodating case and the holder's through-hole space. By positioning the receiving element inside the through-hole of the holder, the patent segments the sonic wave propagation paths, allowing the receiving element to be isolated from harmful vibrations in the main case while maintaining compact integration.
Solution Approach 2:
The patent extracts the receiving element from the main element-accommodating case environment by positioning it within the holder's through-hole. This extraction removes the receiving element from the harmful acoustic environment of the main case, eliminating the interference from wall reflections and propagating vibrations while preserving the compact overall structure.
2Measurement precision
If the reception side vibrating surface is positioned exposed to external space, then it can receive reflected sonic waves, but it becomes susceptible to external noise and interference
Solution Approach 1:
The patent applies local quality by creating a specialized acoustic environment within the holder's through-hole. The receiving element is positioned in a localized space that provides controlled acoustic conditions - allowing it to detect reflected sonic waves while being protected from external noise. This local acoustic optimization enables precise measurement without exposure to general external interference.
Solution Approach 2:
The holder's through-hole acts as an intermediary space between the external environment and the receiving element. This intermediate structure mediates the acoustic interaction, allowing the receiving element to access reflected sonic waves while filtering out harmful external noise through the controlled geometry of the through-hole.
3Device complexity
If the sealing substrate is directly fixed to the element substrate, then the structure is simplified, but mechanical shocks and unwanted vibrations are transmitted to the piezoelectric elements
Solution Approach 1:
The viscoelastic adhesive tape serves as an intermediary layer between the sealing substrate and the element substrate. This intermediate material absorbs and dampens mechanical shocks and unwanted vibrations, preventing them from being transmitted to the piezoelectric elements. The tape maintains the structural connection while filtering harmful mechanical disturbances.
Solution Approach 2:
The patent applies beforehand cushioning by incorporating the viscoelastic adhesive tape as a pre-installed vibration damping layer. This cushioning is built into the structure before operation, providing continuous protection against mechanical shocks and vibrations that may occur during use, thereby enhancing the reliability and vibration resistance of the piezoelectric elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the accuracy of sonic wave detection by minimizing noise from external reflections and mechanical shocks, allowing for precise calculation of distances and maintaining the quality of image formation in recording devices.
Implementation Method 1
a transmitting element (72) having a transmission side piezoelectric element (50B) and a transmission side vibrating surface (43B) coupled to the transmission side piezoelectric element (50B) and capable of transmitting a sonic wave to a medium M, and a receiving element (71) having a reception side piezoelectric element (50A) and a reception side vibrating surface (43A) coupled to the reception side piezoelectric element (50A) and capable of receiving a sonic wave reflected by the medium M
Implementation Method 2
a viscoelastic adhesive tape is used to fix the sealing substrate to the holder, reducing unwanted vibrations
Data Source
AI summary
A sonic wave sensor unit includes an element substrate having a transmitting element having a transmission side piezoelectric element and transmitting a sonic wave to a medium, and a receiving element having a reception side piezoelectric element and a reception side vibrating surface and receiving a sonic wave reflected by the medium, a sonic wave sensor including a sealing substrate configured to seal the transmission side piezoelectric element and the reception side piezoelectric element, and a holder disposed on a side opposite to the element substrate with respect to the sealing substrate in a −Z direction and fixed to the sealing substrate, wherein a through hole penetrating the holder in the −Z direction is formed in the holder, and, in plan view viewed in the −Z direction, the reception side vibrating surface is disposed inside a wall surface of the holder constituting the through hole.