SoP Module Testing via Dual-Side PCB Conductors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional system-on-package (SoP) technologies do not allow for testing of integrated circuits (ICs) after they have been attached to a system board, limiting the ability to verify or retest the functionality of SoCs post-attachment.
Innovation Solution
A system-on-package module with a printed circuit board (PCB) that has electrical paths connecting ICs on opposite sides, enabling testing of one IC before attaching a second IC, using conductors that serve both as test and attachment points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ICs are attached to the system board in conventional SoP, then the system can be assembled, but the IC cannot be tested after attachment
Solution Approach 1:
The system board is divided into two sides: a first side for attaching ICs and a second side for testing. Conductive paths are formed only on the second side, separating the attachment function from the testing function. This allows ICs to be attached on the first side while enabling testing on the second side without complicating the overall structure.
Solution Approach 2:
Conductive paths serve as intermediaries that transfer test signals from the second side through the substrate to the IC on the first side. These paths enable electrical connection and signal transmission without requiring direct access to the IC after attachment, solving the testing problem while maintaining a clean separation of functions.
2Ease of manufacture
If conductors are used for attaching ICs, then the IC can be electrically connected, but testing before attachment becomes difficult
Solution Approach 1:
Conductive paths are pre-formed on the second side of the substrate before IC attachment. This allows test signals to be prepared in advance and transmitted to the IC after attachment, enabling both ease of assembly and reliable testing without requiring complex reconfiguration.
Solution Approach 2:
The conductors on the second side serve dual purposes: they provide electrical connection for attaching ICs and simultaneously serve as test signal transmission paths. This multi-functionality eliminates the need for separate testing infrastructure, simplifying manufacturing while ensuring testing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the testing of ICs before final attachment, ensuring functionality and allowing for potential retesting, thereby improving the reliability and performance of SoP modules in mobile computing devices.
Implementation Method 1
the PCB includes electrical paths along which the first IC and the second IC are electrically connected
Data Source
AI summary
A system on package SoP module includes a printed circuit board (PCB) having a first side and an opposing second side, a first IC attached to the first side, a second IC attached to the second side. The PCB also provides electrical paths for connecting the first IC and the second IC. Conductors by which the second IC is attached to the PCB also allow for electrical testing of the first IC when the SoP is in a system level state.