Sorbic Ester Resin Composition for Low VOC Electrical Insulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electrical insulation resin compositions, such as those based on unsaturated polyesters and epoxy resins, face challenges with high monomer emissions, viscosity issues, and adhesive strength limitations, particularly in achieving rapid hardening and low volatile organic compound (VOC) content.
Innovation Solution
A resin composition comprising the reaction product of epoxy compounds with sorbic acid and a solvent containing vinyl groups, which provides excellent adhesion and thermal stability, hardened by free-radical-forming polymerization initiators, allowing for efficient insulation of electrical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If unsaturated polyester resins with reactive diluents are used for electrical insulation, then the resin composition achieves good processability and insulation properties, but high monomer emissions occur during curing
Solution Approach 1:
The patent changes the chemical composition parameters by using epoxy compounds (which have lower monomer emissions) instead of traditional unsaturated polyester resins, while maintaining the electrical insulation properties through proper selection of epoxy compounds and curing agents
Solution Approach 2:
The invention creates a composite resin composition by combining epoxy compounds with specific curing agents and optional additives, achieving a material that combines the advantages of low emissions with good electrical insulation and adhesion properties
2Strength
If epoxy resin systems are used for electrical insulation, then good adhesion properties are achieved, but the hardening process requires high temperature or complex catalysts
Solution Approach 1:
The patent modifies the curing parameters by selecting curing agents that enable low-temperature or ambient temperature hardening of epoxy resins, eliminating the need for high temperature processing while maintaining adhesion properties
Solution Approach 2:
The invention introduces specific curing agents as intermediaries that facilitate the hardening reaction at lower temperatures, acting as catalysts or reactive components that enable adhesion without requiring high thermal energy input
3Object-generated harmful factors
If epoxy vinyl esters are used for impregnation, then VOC content is reduced, but adhesive strength does not reach the values possible with epoxy resin systems
Solution Approach 1:
The patent creates a composite epoxy-based resin composition that combines the low VOC characteristics of modified epoxies with the high adhesion potential of epoxy systems, achieving both environmental and performance requirements simultaneously
Solution Approach 2:
The invention optimizes specific components of the resin composition (such as the ratio of epoxy compounds to curing agents and the selection of additives) to locally enhance adhesion properties in critical areas while maintaining overall low VOC content
4Object-generated harmful factors
If monomer-free unsaturated polyester resins are used, then monomer emissions are reduced, but viscosity increases
Solution Approach 1:
The patent changes the molecular structure parameters of the resin components, selecting epoxy compounds and modifiers that maintain low viscosity even in the absence of reactive diluents, ensuring good processability without monomer emissions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves rapid hardening with high bond strengths and low VOC content, offering excellent thermal and electrical insulation properties for electrical devices like motors and transformers.
Implementation Method 1
The systems can be hardened by addition of hardeners, and the corresponding gel times are short. The object is further achieved by coating compositions comprising i) 100 parts by weight of a resin composition, and ii) 1 to 3 parts by weight of a free-radical-forming polymerization initiator.
Data Source
AI summary
Resin composition comprising a) the reaction product of a1) one or more epoxy compounds having at least 2 epoxy groups, and a2) sorbic acid as component A; b) a solvent containing vinyl groups as component B; characterized in that a bisphenol F diglycidyl ether or an epoxy novolac is used as epoxy compound a1) in component A.