SOT MRAM MTJ Structure for Compact Magnetic Field Sensing
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Solution Overview
Problem
Current magnetic field sensor technologies, such as AMR and GMR sensors, face issues with high chip area, high cost, high power consumption, limited sensitivity, and susceptibility to temperature variations, necessitating an improved device design.
Innovation Solution
A semiconductor device is fabricated using a spin orbit torque (SOT) MRAM structure with a magnetic tunneling junction (MTJ) stack, featuring a first and second channel layer with different etching rates and a curved sidewall, and utilizing a spin orbit torque effect for magnetic moment switching, employing damascene processes for metal interconnections and dielectric layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional magnetic field sensor technologies (AMR, GMR) are used, then magnetic field sensing function is achieved, but chip area is large, cost is high, power consumption is high, sensitivity is limited, and temperature stability is poor
Solution Approach 1:
The device is segmented into distinct functional regions: a first region containing the MTJ stack for magnetic field sensing, and a second region containing the channel layer for current conduction. This spatial segmentation allows the sensing function and conduction function to be separated, enabling compact integration while maintaining performance
Solution Approach 2:
The MTJ stack is positioned on top of the channel layer, with the channel layer serving as both the conduction path and the bottom electrode for the MTJ. This nested configuration eliminates the need for separate bottom electrode structures, reducing chip area while maintaining functionality
2Reliability
If conventional magnetic field sensor technologies are used, then magnetic field sensing function is achieved, but power consumption is high
Solution Approach 1:
The invention replaces conventional magnetic field sensing mechanisms (which require complex magnetic circuit structures) with a spin-orbit torque based MTJ structure. The spin current generated through the spin Hall effect in the channel layer directly switches the magnetic state of the MTJ, eliminating the need for large current loops and reducing power consumption significantly
3Reliability
If conventional magnetic field sensor technologies are used, then magnetic field sensing function is achieved, but sensitivity is limited
Solution Approach 1:
The invention utilizes parameter changes in the spin Hall angle of the channel layer material to control the efficiency of spin current generation. By selecting materials with optimized spin Hall angles, the sensitivity of the magnetic field sensing is enhanced while maintaining a relatively simple device structure
Solution Approach 2:
The channel layer is formed as a composite structure with specific material composition designed to exhibit high spin Hall angle. This composite material approach enables enhanced spin current generation efficiency, thereby improving sensing sensitivity without requiring complex device architectures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SOT MRAM device enhances device endurance, read stability, and write speed by isolating read/write paths and preventing side effects like coercivity reduction and heating, while improving switching efficiency through spin current application.
Implementation Method 1
The physical definition of such effect is defined as a variation in resistance obtained by dividing a difference in resistance under no magnetic interference by the original resistance. Currently, MR effect has been successfully utilized in production of hard disks thereby having important commercial values.
Implementation Method 2
utilizing a spin orbit torque effect for magnetic moment switching
Data Source
AI summary
A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a first metal interconnection and a second metal interconnection in the first IMD layer; forming a channel layer on the first metal interconnection and the second metal interconnection; forming a magnetic tunneling junction (MTJ) stack on the channel layer; and removing the MTJ stack to form a MTJ.


