Sound Component Assembly Sealing and Cover Design

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Solution Overview

Problem

Existing sound component assemblies in electronic devices face challenges in preventing damage and optimizing space usage within the housing, particularly in maintaining a waterproof structure while ensuring efficient sound transmission and reception.

Innovation Solution

A sound component assembly is designed with a sealing portion that contacts the printed circuit board (PCB) and includes a mesh portion to block foreign materials, while a cover portion with greater hardness covers the sealing and mesh portions to prevent damage and enhance waterproofing, thereby reducing the risk of sound leakage and space increase.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a waterproof structure is implemented to prevent foreign material from entering through the sound hole, then the reliability of the sound module is improved, but the device complexity increases due to additional sealing components

Engineering Contradiction:
Improvewaterproof performanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the sealing portion and cover portion into a single integrated sound component assembly that surrounds the sound passage. This merging of functions reduces the number of separate components while maintaining the waterproof structure, thereby improving reliability without proportionally increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sound component assembly serves multiple functions simultaneously: it provides waterproof sealing, blocks foreign material, and maintains the structural integrity of the sound passage. This multi-functionality reduces the need for separate components, addressing the complexity issue while maintaining reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If the sound component assembly is positioned between the sound hole and sound module to surround the sound passage, then the waterproof performance is improved, but the space occupation within the housing increases

Engineering Contradiction:
Improvewaterproof performanceVSAvoidspace occupation
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The sound component assembly is nested within the existing housing structure, positioning itself between the sound hole and sound module. This nested arrangement allows the waterproof structure to be integrated into the existing space without requiring additional external volume, thereby minimizing space occupation while maintaining waterproof performance.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If a mesh portion is added to block foreign material from passing through the sound passage, then the reliability is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improveforeign material blockingVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The mesh portion utilizes a porous or perforated material structure that allows sound waves to pass through while blocking foreign material. This approach simplifies manufacturing compared to creating complex geometric shapes, as the mesh can be produced through standard drilling or extrusion processes, thereby improving reliability without significantly increasing manufacturing complexity.

Inventive Principle:
Principle #31Porous materials

4Strength

If the cover portion is made with greater hardness than the sealing portion to prevent damage, then the strength is improved, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvedamage resistanceVSAvoidhardness control
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The sound component assembly uses composite materials with different hardness levels for different portions: the cover portion is made from harder material for damage resistance, while the sealing portion uses softer, more compliant material for effective sealing. This material differentiation can be achieved through standard composite manufacturing processes without requiring excessive precision, as each material is optimized for its specific function.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the risk of damage to the sound component assembly, maintains a waterproof structure, and optimizes space usage within the electronic device housing by integrating the sealing and cover portions, ensuring efficient sound transmission and reception.

Implementation Method 1

a mesh portion that traverses the sound passage and contacts a second side of the sealing portion, opposite to the first side of the sealing portion, and the mesh portion is configured to block foreign material from passing therethrough

Methodology Applied
Scientific EffectPhysical filtration: Filter (physical)

Implementation Method 2

a sealing portion that surrounds the sound passage and that includes an internal cavity therein that communicates with the sound passage, the sound passage sealed by the sealing portion by a first side of the sealing portion contacting at least a portion of the PCB

Methodology Applied
Scientific EffectPhysical sealing: Physical Containment

Implementation Method 3

a cover portion that faces the PCB and covers a portion of the sealing portion or a portion of the mesh portion... the second material has a greater hardness than the first material

Methodology Applied
Scientific EffectMechanical protection: Mechanical Force

Data Source

PatentUS11962960B2Electronic device including sound component assembly
Publication Date: 2024.04.16 SAMSUNG ELECTRONICS CO LTD
  • US11962960B2 patent drawing
  • US11962960B2 patent drawing
  • US11962960B2 patent drawing

AI summary

A sound component assembly includes: a sealing portion provided in a sound passage connected to a sound hole of an electronic device to surround a portion of the sound passage and contact at least a portion of a printed circuit board (PCB) having a sound module mounted thereon; and a cover portion disposed to face the PCB outside the sealing portion, wherein the sealing portion may include a first material, the cover portion may include a second material, and the second material may have a greater hardness than a hardness of the first material.