Sound-Damping Gypsum Wallboard With Selective Encasing Removal

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Solution Overview

Problem

Conventional building constructions with gypsum wallboards often suffer from poor acoustical performance and low sound transmission class (STC) ratings, leading to noise pollution and privacy issues, and existing methods to improve this using sound damping adhesives are hindered by difficulties in cutting and bonding with gypsum materials.

Innovation Solution

A sound damping wallboard structure comprising gypsum layers with encasing layers on both sides, where parts of the encasing layers are removed to expose the gypsum surfaces for applying a sound damping layer, enhancing bonding and ease of installation while maintaining structural robustness and acoustical performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If sound damping adhesive is incorporated between wallboards to create a single panel, then acoustical performance is improved, but the wallboard becomes difficult to cut due to the two layers of paper or encasing material

Engineering Contradiction:
Improveacoustical performanceVSAvoidease of cutting
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent removes the encasing material from the inner faces of the wallboards, extracting only the necessary components for sound damping while eliminating the problematic paper layers that hinder cutting. This allows the sound damping adhesive to bond directly to the gypsum core without the interference of encasing materials.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies different properties to different parts of the wallboard structure. The outer faces retain encasing material for structural integrity and surface finish, while the inner faces have the encasing material removed to enable proper adhesive bonding and maintain cutability. This localized modification resolves the contradiction between sound damping performance and ease of cutting.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If two wallboards without paper or encasing material on the inside faces are coupled, then ease of bonding is improved, but misalignment, warping, and pulling apart occur

Engineering Contradiction:
Improveease of bondingVSAvoidstructural stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent applies encasing material selectively: present on outer faces for structural support and stability, but removed from inner faces to allow direct adhesive bonding to the gypsum core. This localized differentiation enables both ease of bonding and structural stability to coexist.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent creates a composite structure combining gypsum core layers with selective encasing material application. The gypsum core provides bonding surface and structural stability, while the strategically placed encasing material on outer faces prevents warping and pulling apart, creating a composite that achieves both ease of bonding and structural integrity.

Inventive Principle:
Principle #40Composite materials

3Ease of operation

If conventional gypsum wallboards are used, then ease of installation is maintained, but acoustical performance and sound transmission class rating are poor

Engineering Contradiction:
Improveease of installationVSAvoidacoustical performance
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent segments the wallboard into distinct functional layers: gypsum core layers for structural integrity and bonding, selective encasing material for surface protection, and sound damping adhesive layer for acoustical performance. This segmentation allows each component to optimize its function while maintaining overall ease of installation as a single panel.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates a composite wallboard structure combining gypsum core, selective encasing material, and sound damping adhesive. This composite construction achieves superior acoustical performance and STC ratings while maintaining the ease of installation characteristic of conventional wallboards, as the entire assembly functions as a single pre-bonded panel.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a structurally robust sound damping wallboard with improved STC performance, facilitating easier installation and reducing misalignment and warping issues, while maintaining the ability to be easily cut or scored for use in building construction.

Implementation Method 1

A sound damping layer is positioned on the first side, and covers at least part of the first encasing layer portion and the first gypsum surface portion

Methodology Applied
Scientific EffectSound damping: Acoustic Absorption

Data Source

PatentUS11939765B2Sound damping wallboard and method of forming a sound damping wallboard
Publication Date: 2024.03.26 GOLD BOND BUILDING PRODUCTS LLC
  • US11939765B2 patent drawing
  • US11939765B2 patent drawing
  • US11939765B2 patent drawing

AI summary

A sound damping wallboard and methods of forming a sound damping wallboard are disclosed. The sound damping wallboard comprises a gypsum layer with a gypsum surface having an encasing layer. The encasing layer is partially removed to expose the gypsum surface and form a gypsum surface portion and a first encasing layer portion on the gypsum layer. A sound damping layer is applied to the gypsum layer to cover at least part of the gypsum surface portion and the encasing layer portion.