Source Container Flow Restricting Member for Vapour Uniformity
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Solution Overview
Problem
Vapour-deposition using solid phase sources faces issues of non-uniformity in the amount of carried vapour precursor and precipitation, due to heat sensitivity and low vapour pressure, leading to reproducibility problems in film formation.
Innovation Solution
A source container design with flow restricting members and temperature control, featuring a first and second space for vapour precursor mixing, where the carrier gas flow is manipulated to ensure uniform temperature and prevent particle introduction to the discharging port, using a flow barrier surface to elongate gas flow distance and maintain consistent vapour precursor delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If solid phase source is used for vapour deposition, then stability of source material is improved, but uniformity of vapour precursor delivery deteriorates due to low vapour pressure and heat sensitivity
Solution Approach 1:
The container is divided into a first space for accommodating the source material and a second space for mixing carrier gas and vapour. This segmentation allows the source material to remain stable in the first space while enabling controlled vapour generation and mixing in the second space, resolving the contradiction between source stability and vapour delivery uniformity.
Solution Approach 2:
A flow restricting member is introduced as an intermediary component between the source material and the discharging port. This member provides a flow barrier surface that controls gas flow patterns, ensuring uniform mixing of carrier gas and vapour while preventing direct exposure of the stable source material to the discharge path, thus achieving both source stability and uniform vapour delivery.
2Quantity of substance
If heating is applied to generate vapour from solid phase source, then vapour pressure is improved, but temperature uniformity deteriorates causing precipitation and non-uniformity
Solution Approach 1:
By separating the heating zone (first space with source material) from the mixing zone (second space), the patent achieves localized heating that generates sufficient vapour pressure while preventing temperature non-uniformity in the mixing region. The flow restricting member further ensures uniform temperature distribution in the second space by controlling flow patterns.
Solution Approach 2:
The flow restricting member acts as a mediator that distributes thermal energy uniformly across the mixing space. Its flow barrier surface creates a laminar flow pattern that prevents hot spots and precipitation, maintaining temperature uniformity while still allowing sufficient vapour generation from the heated source material.
3Productivity
If gas flow distance is shortened for efficient vapour transport, then productivity is improved, but particle formation increases due to incomplete mixing and decomposition
Solution Approach 1:
The patent segments the transport path into two distinct regions: a first space for source accommodation and a second mixing space. This segmentation allows sufficient residence time for complete mixing and decomposition in the second space before rapid transport to the substrate, reducing particle formation while maintaining productivity.
Solution Approach 2:
The flow restricting member serves as an intermediary that optimizes the balance between mixing time and transport speed. By creating a controlled flow barrier, it ensures complete decomposition and mixing in the second space while maintaining efficient overall transport, thereby preventing particle formation without sacrificing productivity.
4Manufacturing precision
If flow barrier surface is introduced to control gas flow, then temperature uniformity and vapour precursor uniformity are improved, but device complexity increases
Solution Approach 1:
The flow restricting member is strategically positioned only in the second mixing space where flow control is most critical. This localized approach provides the necessary temperature and vapour uniformity precisely where needed, without adding complexity to the entire device structure.
Solution Approach 2:
The flow restricting member performs multiple functions simultaneously: it controls gas flow patterns, ensures uniform mixing, prevents particle formation, and maintains temperature uniformity. This multi-functionality achieves high manufacturing precision without proportionally increasing device complexity, as a single component addresses multiple critical requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances temperature uniformity, reduces particle formation and incomplete decomposition, ensuring a constant vapour precursor supply and preventing defects in fabricated devices by maintaining a laminar gas flow and blocking particle introduction to the discharging port.
Implementation Method 1
maintaining a laminar gas flow
Implementation Method 2
a vapour precursor is formed within the source container by heating the source
Implementation Method 3
a vapour precursor is formed within the source container by heating the source
Implementation Method 4
the vapour precursor may be carried to the reactor by a suitable carrier gas
Data Source
AI summary
The present invention relates to a source container and to a vapor-deposition reactor. The source container according to one embodiment of the present invention comprises: a container comprising an inner wall for delimiting a first space for holing a source material, and a second space which is adjacent to the first space and is for the mixing of vapor emitted from the source material and a carrier gas taken into the inside thereof; a carrier gas inflow pathway which connects the outside of the container second space; a mixed gas discharge pathway which connects the outside of the container and the second space; and a flow-limiting member which expands inside the second space, and provides a first flow barrier surface between the inflow port and the discharge port.