Source-Drain Epitaxial Structure for Lower FET Channel Resistance
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Solution Overview
Problem
The challenge in semiconductor technology is to reduce the channel resistance of field effect transistors (FETs) to minimize transistor delay, which is exacerbated by an underlap between the gate terminal and the source/drain terminal, leading to degraded performance.
Innovation Solution
A semiconductor device structure is introduced with a diffusion enhancement layer, such as a silicon germanium layer, sandwiched between the channel region and the source/drain region to enhance dopant diffusion, reducing channel resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If an underlap is introduced between the gate terminal and the source/drain terminal, then the transistor delay is reduced, but the channel resistance increases
Solution Approach 1:
A gate spacer is introduced as an intermediary structure between the gate terminal and the source/drain terminal. The gate spacer is positioned to overlap with the source/drain terminal, creating a physical and electrical bridge that reduces channel resistance while allowing the gate-terminal underlap to maintain reduced transistor delay. This intermediary structure resolves the contradiction by providing a pathway for charge carriers without requiring direct gate-source/drain overlap.
2Reliability
If the gate terminal and source/drain terminal are directly overlapped, then the channel resistance is reduced, but the transistor delay increases
Solution Approach 1:
The structure is segmented into distinct regions: the gate terminal, the gate spacer, and the source/drain terminal. The gate spacer is separated from both the gate terminal and the source/drain terminal by controlled gaps, allowing each component to perform its function independently. This segmentation enables the gate spacer to reduce channel resistance through overlap with the source/drain terminal while the gate-terminal underlap maintains reduced transistor delay, avoiding the need for direct gate-source/drain overlap.
3Reliability
If a diffusion enhancement layer is added between the channel region and the source/drain region, then dopant diffusion is enhanced and channel resistance is reduced, but the device complexity increases
Solution Approach 1:
The gate spacer's physical and electrical parameters are optimized to achieve effective dopant diffusion enhancement. By controlling the gate spacer's thickness, material composition, and positioning, the structure enhances dopant diffusion into the channel region without requiring additional diffusion enhancement layers. This parameter optimization resolves the contradiction by achieving low channel resistance through the gate spacer's inherent properties rather than adding complex multi-layer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution boosts the transistor's on-current, improving performance by enhancing dopant diffusion and reducing channel resistance.
Implementation Method 1
A semiconductor device structure is introduced with a diffusion enhancement layer, such as a silicon germanium layer, sandwiched between the channel region and the source/drain region to enhance dopant diffusion, reducing channel resistance.
Data Source
AI summary
The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a fin structure over the substrate, a gate structure over a first portion of the fin structure, and an epitaxial region formed in a second portion of the fin structure. The epitaxial region can include a first semiconductor layer and an n-type second semiconductor layer formed over the first semiconductor layer. A lattice constant of the first semiconductor layer can be greater than that of the second semiconductor layer.


