Source Driver Heat Dissipation Structure Flatness

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Solution Overview

Problem

The existing methods for heat dissipation in source drivers, such as adhering cooling aluminum foils, often result in uneven adherence due to the thickness of the source driver, leading to deformation and a compromised heat dissipation effect.

Innovation Solution

A heat dissipation structure is adhered to the upper surface of the source driver, avoiding adherence to the right-angle sides and corners, ensuring a flat surface and efficient heat conduction, with a design that includes a central body and integrated sides parallel to the surface for optimal alignment and reduced material usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the cooling aluminum foil is adhered to the upper surface of the source driver, then the heat dissipation effect is improved, but the aluminum foil deforms due to uneven adhering at the corners and sides

Engineering Contradiction:
Improveheat dissipation effectVSAvoidflatness of aluminum foil
Core Design Contradiction:
TemperatureVSShape

Solution Approach 1:

The patent applies different adherence properties to different regions of the heat dissipation structure. The central region is designed to be adhered to the source driver for heat dissipation, while the peripheral regions (corners and sides) are designed not to be adhered, allowing them to remain flat and undeformed. This local differentiation resolves the contradiction by ensuring heat dissipation effectiveness in the central area while maintaining structural flatness at the periphery.

Inventive Principle:
Principle #3Local quality

2Area of stationary object

If the heat dissipation structure is adhered to the entire upper surface including corners and sides, then the heat dissipation area is increased, but deformation occurs affecting heat dissipation efficiency

Engineering Contradiction:
Improveheat dissipation areaVSAvoidheat dissipation efficiency
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent divides the heat dissipation structure into different functional zones: a central adhered region for heat conduction and a non-adhered peripheral region for maintaining flatness. This local quality differentiation ensures that the heat dissipation area is optimized in the central region while the peripheral regions maintain their structural integrity and flatness, thereby preserving overall heat dissipation efficiency.

Inventive Principle:
Principle #3Local quality

3Temperature

If the cooling aluminum foil is adhered to the source driver, then heat dissipation is enhanced, but the source driver thickness causes uneven adhering and deformation

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidadherence uniformity
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The patent addresses the manufacturing precision issue by designing the heat dissipation structure with non-adhered peripheral regions. This design choice accepts that complete uniform adherence across the entire surface is difficult to achieve due to source driver thickness variations, but ensures that the critical central region maintains good adherence for heat dissipation while the peripheral regions are excluded from adherence requirements, thus resolving the contradiction between heat dissipation enhancement and adherence uniformity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach maintains a flat surface for efficient heat dissipation, prevents deformation of the heat dissipation structure, and ensures stable operation of the source driver by aligning with the source driver's heat generation areas, enhancing the heat dissipation efficiency and reducing production costs.

Implementation Method 1

ensuring a flat surface and efficient heat conduction

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11432441B2Display panel and display apparatus
Publication Date: 2022.08.30 HKC CORP LTD
  • US11432441B2 patent drawing
  • US11432441B2 patent drawing
  • US11432441B2 patent drawing

AI summary

The present application discloses a display module (20) and a display apparatus (10). The display panel (10) includes a heat dissipation structure (70) for dissipating heat of a source driver (60). The heat dissipation structure (70) is adhered to an upper surface (61) of the source driver (60) far away from the printed circuit board (50), and at least one side or top corner of the upper surface (61) is not adhered with the heat dissipation structure.