Thermally Conductive Unit for Source IC Heat Dissipation
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Solution Overview
Problem
Organic electroluminescent display devices face heat dissipation challenges due to high temperatures generated by source ICs, which reduce their lifespan and efficiency, and existing solutions like thermally conductive pads and fans are either inefficient or complex, contradicting the slim outline trend.
Innovation Solution
A thermally conductive unit is introduced, comprising a metallic cover plate with elastic first and second thermally conductive pads that effectively transfer heat from the source IC to the bottom case, maximizing thermal conductivity and minimizing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive pad is attached on the source IC to absorb heat, then heat absorption is improved, but heat transfer efficiency deteriorates because the absorbed heat is accumulated in the pad and cannot be transferred outside effectively
Solution Approach 1:
A thermally conductive unit is introduced as an intermediary component between the source IC and the bottom case. This unit includes a thermally conductive plate with first and second thermally conductive pads that facilitate heat transfer from the source IC through the plate to the bottom case, solving the problem of heat accumulation in the original pad while maintaining effective heat absorption.
Solution Approach 2:
The thermally conductive unit is segmented into multiple functional parts: a thermally conductive plate as the main body, a first thermally conductive pad for contact with the source IC, and a second thermally conductive pad for contact with the bottom case. This segmentation allows each part to perform its specific function optimally, with the plate serving as the primary heat transfer pathway.
2Temperature
If a fan or heat pipe is installed in the bottom case to provide thermal conduction, then heat dissipation is improved to some extent, but device complexity increases and installation becomes complex
Solution Approach 1:
The thermally conductive unit combines multiple thermal management functions into a single integrated component. The thermally conductive plate with attached pads merges the functions of heat absorption, heat conduction, and heat dissipation into one unit that is installed in a single location, eliminating the need for separate fans or heat pipes in the bottom case.
Solution Approach 2:
The thermally conductive unit provides self-service heat dissipation through its inherent thermal conductivity. The plate and pads automatically conduct heat from the source IC to the bottom case without requiring external active cooling components, simplifying the overall device structure while maintaining effective thermal management.
3Loss of energy
If thermally conductive means are added to improve heat transfer, then heat transfer efficiency is improved, but the slim outline of the device is compromised
Solution Approach 1:
The thermally conductive unit utilizes thin pad structures that can be attached to the surfaces of the source IC and bottom case. These thin pads provide effective thermal contact without adding significant thickness to the device, maintaining the slim outline while enabling efficient heat transfer across the interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermally conductive unit significantly reduces the temperature of source ICs by about 30 degrees Celsius, enhancing heat dissipation and extending their lifespan while maintaining a slim device profile.
Implementation Method 1
a thermally conductive unit configured to be between the at least one source IC and the bottom case and contact the at least one source IC and the bottom case
Data Source
AI summary
An organic electroluminescent display device includes forming an organic electroluminescent panel that includes a viewing surface for displaying images and an opposing surface and includes a plurality of source pads in a peripheral region of the organic electroluminescent panel; configuring at least one source IC to be on the opposing surface of the organic electroluminescent panel, wherein the at least one source IC outputs a source signal corresponding to the source pad; configuring a thermally conductive unit to contact the at least one source IC at an inner surface of the thermally conductive unit; and configuring a bottom case to contact an outer surface of the thermally conductive unit.