Source Pad Wire Layout for Single-Step Disconnection Detection
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently detecting disconnections in source wires while reducing resistance, as current methods require multiple inspections and are limited by high-resistance connection portions, which hinder the provision of multiple source wires.
Innovation Solution
A semiconductor device configuration with a disconnection detection wire connected to a source pad and a disconnection detection terminal, allowing for a single inspection to detect disconnections in multiple source wires by comparing voltage values, and a method to reduce resistance by connecting source terminals and wires in a specific arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple source terminals are used to detect disconnection in source wires, then disconnection detection capability is improved, but the number of inspections required increases and detection efficiency deteriorates
Solution Approach 1:
The patent combines multiple disconnection detection functions into a single inspection by introducing a common reference potential terminal that serves as a shared reference for measuring potentials at multiple source terminals simultaneously, thereby improving inspection efficiency while maintaining detection capability
Solution Approach 2:
The reference potential terminal performs multiple functions: it serves as a common reference point for all source terminal measurements, enables simultaneous detection across multiple wires, and provides a stable baseline for potential measurements without requiring separate measurement circuits for each terminal
2Measurement precision
If high-resistance connection portions are used to ensure measurement accuracy, then measurement precision is improved, but the ability to provide multiple source wires is limited
Solution Approach 1:
The patent extracts the high-resistance function from the connection portions and relocates it to the reference potential terminal, allowing connection portions to maintain low resistance for multiple wire connections while the reference terminal provides the necessary high-impedance reference point for accurate measurements
Solution Approach 2:
The reference potential terminal acts as an intermediary that decouples the measurement reference function from the connection structure, enabling multiple low-resistance connections to coexist with high-precision measurement capabilities through a dedicated reference node
3Device complexity
If source terminals are used for both power connection and disconnection detection, then device complexity is reduced, but detection accuracy deteriorates due to inability to distinguish individual wire disconnections
Solution Approach 1:
The patent segments the detection function by introducing a dedicated reference potential terminal that is electrically connected to the source pad but electrically isolated from the source terminals during measurement, enabling individual wire disconnection identification while maintaining a simple overall terminal structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy detection of disconnections in source wires and reduces resistance, enabling efficient manufacturing and inspection processes.
Implementation Method 1
detecting disconnection in the plurality of source wires by causing a current to flow between a source terminal connected to respective one ends of the plurality of source wires and a disconnection detection terminal and measuring a voltage
Data Source
AI summary
A semiconductor device making it easy to detect disconnection in source wires and achieving a reduction in resistance and an inspection method for the semiconductor device are provided. A semiconductor device according to the present embodiment includes: a lead frame; a semiconductor chip on the lead frame; a source pad provided in the semiconductor chip; a plurality of source wires connected to the source pad; a disconnection detection wire connected to the source pad; source terminals connected to the plurality of source wires; and a disconnection detection terminal connected to the disconnection detection wire. One end of the disconnection detection wire is positioned in vicinity of a corner of the source pad closer to the disconnection detection terminal side.