Source PCB Thermal Layout for Stable Display Bonding
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Solution Overview
Problem
In the bonding process of printed circuit boards for display devices, maintaining a stable bonding temperature and preventing heat transfer to unnecessary areas is challenging, leading to potential bonding failures and increased power consumption.
Innovation Solution
The source printed circuit board includes a multi-layered structure with copper plate layers, mesh areas, air holes, and specific through holes to concentrate and retain heat at the bonding area, preventing heat transfer to other areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is applied to the bonding area to maintain bonding temperature, then bonding reliability is improved, but heat is transferred to unnecessary areas causing increased power consumption
Solution Approach 1:
The patent applies local quality by creating a thermal insulation structure specifically at the bonding area using an air hole and insulating material layer. This localized approach maintains high temperature only where needed for bonding while preventing heat transfer to unnecessary areas, thus improving bonding reliability without excessive power consumption
Solution Approach 2:
The patent introduces an intermediary thermal insulation structure consisting of an air hole and insulating material layer between the bonding area and the rest of the PCB. This intermediary structure acts as a thermal barrier that prevents harmful heat transfer to unnecessary areas while allowing the bonding area to maintain required temperature
2Temperature
If heat is applied to the bonding area, then bonding temperature is maintained, but heat transfer to unnecessary areas occurs causing potential damage
Solution Approach 1:
The thermal insulation structure is locally applied at the bonding area using an air hole and insulating material layer. This localized insulation maintains high temperature at the bonding area while preventing heat transfer to unnecessary areas, thus maintaining bonding temperature without causing harmful heat transfer
Solution Approach 2:
The patent converts the potentially harmful heat transfer to unnecessary areas into a beneficial localized heating effect. By insulating the bonding area, the heat that would otherwise be wasted is now concentrated where needed, maintaining bonding temperature while preventing damage to other areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures stable bonding by maintaining the bonding temperature above a reference point and reduces heat transfer, enhancing bonding stability and reducing power consumption.
Implementation Method 1
an air hole is disposed in a lower part of the third copper plate layer corresponding to the pad area
Implementation Method 2
a first copper plate layer disposed on a first substrate layer, a second substrate layer disposed on the first copper plate layer, a second copper plate layer disposed on the second substrate layer, a third substrate layer disposed on the second copper plate layer, and a third copper plate layer disposed on the third substrate layer
Data Source
AI summary
A source printed circuit board and a display device including the source printed circuit board are disclosed. The source printed circuit board includes a second copper plate layer that includes a mesh area corresponding to a pad area, an air hole is disposed in the lower part of a third copper plate layer corresponding to the pad area, and a back drill through hole connected to the second copper plate layer and the third copper plate layer is not connected to a first copper plate layer, thereby maintaining the bonding temperature.