Semiconductor Source Vessel Cleaning Using Negative-Pressure Solvent Transfer
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Solution Overview
Problem
Buildup of impurities in semiconductor manufacturing vessels leads to dose variation and defects, necessitating vessel replacement and tool downtime.
Innovation Solution
A method and apparatus for cleaning semiconductor source vessels using a solvent to form a solution, which is transferred to a waste vessel under negative pressure, facilitated by a bellow mechanism or liquid pump, and then drained using a bellow expansion or vacuum pump, with optional ashing to remove residues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vessels are periodically refilled during the manufacturing process, then continuous production is maintained, but buildup of impurities occurs in the vessels
Solution Approach 1:
The system divides the vessel into multiple zones with different cleaning intensities. The ultrasonic transducers create localized high-intensity cleaning zones at the bottom and sides of the vessel, while the top portion receives gentler cleaning. This segmented approach allows effective impurity removal without disrupting the overall continuous manufacturing process.
Solution Approach 2:
The cleaning system performs preliminary impurity removal during the refilling process itself. By incorporating ultrasonic cleaning and solvent flushing before the vessel is fully refilled and returned to service, impurities are eliminated in advance, preventing dose variation and defect issues that would require vessel replacement.
2Reliability
If vessels are removed from the tool and replaced, then impurity buildup is eliminated, but the semiconductor manufacturing tool is shut down and inoperable
Solution Approach 1:
The vessel performs self-cleaning through the integrated ultrasonic cleaning system and solvent flushing mechanism. The cleaning apparatus is built into the vessel structure itself, with ultrasonic transducers mounted on the vessel walls and bottom. This allows the vessel to clean itself during the refilling operation without requiring removal from the tool, eliminating tool downtime while ensuring vessel cleanliness.
Solution Approach 2:
A solvent is introduced as an intermediary substance to facilitate the cleaning process. The solvent is pumped into the vessel through the refilling port, dissolves impurities, and is then drained away. This intermediary chemical agent enables effective cleaning without mechanical intervention that would require tool shutdown.
3Reliability
If ultrasonic cleaning is applied to the vessel, then impurities are removed, but the cleaning system complexity increases
Solution Approach 1:
The ultrasonic cleaning system is merged with the existing refilling infrastructure. The ultrasonic transducers are integrated into the vessel structure, and the cleaning process is combined with the solvent refilling and draining operations. This merging reduces overall system complexity by utilizing existing ports, pumps, and control mechanisms for both refilling and cleaning functions, rather than creating separate independent systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes impurities from vessels, preventing dose variation and defects, allowing continuous operation of semiconductor manufacturing tools.
Implementation Method 1
The waste vessel may have a bellow or other mechanism inside of it to create a negative pressure in the waste vessel to pull the solution out of the source vessel and into the waste vessel
Implementation Method 2
the apparatus further comprises a heating element disposed on an external surface of the first vessel and configured to maintain the first vessel at a first temperature
Data Source
AI summary
Various embodiments of the present technology may provide methods and apparatus for cleaning a source vessel. The source vessel may be filled or partially filled with a solvent to form a solution. The solution is removed from the source vessel and contained in a waste vessel that is connected to the source vessel. The waste vessel may have a bellow or other mechanism inside of it to create a negative pressure in the waste vessel to pull the solution out of the source vessel and into the waste vessel. Alternatively, a liquid pump may be used to pull the solution from the source vessel to the waste vessel.