Source Vessel Cleaning with Negative-Pressure Waste Transfer
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Solution Overview
Problem
Buildup of impurities in semiconductor manufacturing vessels leads to dose variation and defect issues, necessitating vessel replacement and tool downtime.
Innovation Solution
A method and apparatus for cleaning semiconductor source vessels using a solvent to form a solution, which is transferred to a waste vessel under negative pressure, utilizing a bellow mechanism or liquid pump to remove impurities effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the vessel is replaced when impurities buildup occurs, then the manufacturing precision is maintained, but the productivity decreases due to tool downtime
Solution Approach 1:
The system performs cleaning actions before the vessel becomes contaminated to the extent that replacement is required. By continuously monitoring impurity levels and proactively initiating cleaning cycles, the system prevents the need for vessel replacement and associated tool downtime, thereby maintaining both manufacturing precision and productivity.
Solution Approach 2:
The cleaning system operates continuously or periodically to maintain the vessel in a clean state throughout the manufacturing process. This continuous maintenance action eliminates interruptions for vessel replacement, ensuring uninterrupted tool operation while preserving manufacturing precision through consistent impurity removal.
2Productivity
If the vessel is cleaned in-place, then the productivity is maintained, but the device complexity increases
Solution Approach 1:
The cleaning system is designed to handle multiple functions within a single integrated platform. The same apparatus that monitors impurity levels also initiates cleaning cycles, and the cleaning mechanism can service different vessel types. This multi-functionality reduces overall system complexity while enabling in-place cleaning that maintains productivity.
Solution Approach 2:
The system introduces intermediary cleaning agents and mechanisms that facilitate in-place cleaning without requiring vessel removal. By using soluble cleaning agents that can be delivered through existing vessel ports and employing automated injection/removal mechanisms, the system simplifies the cleaning process while maintaining continuous tool operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents vessel replacement and tool downtime by efficiently removing impurities, maintaining process consistency and reducing defects during semiconductor manufacturing.
Implementation Method 1
The waste vessel may have a bellow or other mechanism inside of it to create a negative pressure in the waste vessel to pull the solution out of the source vessel and into the waste vessel
Implementation Method 2
the apparatus further comprises a heating element disposed on an external surface of the first vessel and configured to maintain the first vessel at a first temperature
Data Source
AI summary
Various embodiments of the present technology may provide methods and apparatus for cleaning a source vessel. The source vessel may be filled or partially filled with a solvent to form a solution. The solution is removed from the source vessel and contained in a waste vessel that is connected to the source vessel. The waste vessel may have a bellow or other mechanism inside of it to create a negative pressure in the waste vessel to pull the solution out of the source vessel and into the waste vessel. Alternatively, a liquid pump may be used to pull the solution from the source vessel to the waste vessel.