Spacecraft Heat Pipe Attachment Using Compliant Thermal Paste
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Solution Overview
Problem
Current methods for attaching heat-emitting devices to capillary heat pipes in spacecraft are complex, time-consuming, and result in inefficient thermal conduction due to the need for precise manual alignment and significant force application, leading to distortion and reduced thermal conductivity.
Innovation Solution
A method involving the use of thermally-conductive self-curing paste and standard components, such as capillary heat pipes without lateral edges and female attachment bodies with spacers, allows for easier and faster attachment of heat-emitting devices to spacecraft panels, ensuring consistent thermal conduction without the need for custom heat pipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If significant force is applied to the attaching screws to press carbon pads into micro-roughnesses, then thermal conduction is improved, but the electronic component, heat pipe, and panel bend due to the tension
Solution Approach 1:
A compliant thermal interface material (TIM) is introduced as an intermediary between the heat-emitting device and the capillary heat pipe. This TIM layer accommodates surface micro-roughnesses and maintains thermal contact without requiring excessive clamping force that would cause bending of the components.
2Manufacturing precision
If the spacing between capillary heat pipe and electronic device is precisely controlled using washers, then thermal conduction is improved, but the attachment process becomes long and tedious
Solution Approach 1:
The compliant thermal interface material serves itself by automatically conforming to the spacing requirements and surface irregularities. The material's compliance allows it to self-adjust to the optimal thickness, eliminating the need for manual measurement and precise washer selection.
3Manufacturing precision
If custom heat pipes with specific attachment hole positions are used for each electronic component position, then thermal conduction is optimized, but the manufacturing complexity and time increase
Solution Approach 1:
A standardized capillary heat pipe design with universal attachment features is implemented, allowing the same heat pipe type to be used across multiple positions and configurations. The compliant TIM compensates for positioning variations, eliminating the need for custom-machined heat pipes for each specific application.
4Manufacturing precision
If the number of attachment points is increased to improve thermal conduction, then thermal conduction is enhanced, but the attachment process becomes more complex and time-consuming
Solution Approach 1:
The compliant thermal interface material acts as a mediator that distributes thermal contact across the interface area, reducing the need for multiple discrete attachment points. The material's compliance ensures continuous thermal contact even with fewer attachment points, simplifying the overall attachment process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the attachment process, reduces manufacturing time, and enhances thermal conduction between electronic components and heat pipes, improving the thermal management of spacecraft while allowing for easier reconfiguration or replacement of components.
Implementation Method 1
ensuring good thermal conduction between the electronic devices 2 and the capillary heat pipes 4
Implementation Method 2
A "liquid" type of filler—typically silicone resins which are applied in liquid form and then harden to form a solid mass
Data Source
AI summary
A method for attaching a heat-emitting device and a capillary heat pipe to a panel of a spacecraft wall is disclosed including the steps of: a) positioning a capillary heat pipe on a portion of the panel; attaching female attachment bodies to the panel, the female attachment bodies protruding relative to the capillary heat pipe; c) placing a thermally-conductive and self-curing paste over a portion of the capillary heat pipe or over a heat-emitting device; d) placing a heat-emitting device on the thermally-conductive and self-curing paste and on the female attachment bodies, said heat-emitting device bearing against and being in direct contact with the female attachment bodies, and e) attaching the heat-emitting device and said capillary heat pipe to the panel by attaching male attachment members to the female attachment bodies.