Spacecraft Panel Bracket Assembly for Repeatable Quasi-0G Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing spacecraft platforms composed of aluminum honeycomb panels and embedded inserts are insufficiently durable for space operations, lacking consistency and reliability, and require improved flexibility for Assembly, Integration, and Testing (AI&T) with easy access to internal units.
Innovation Solution
A spacecraft platform structure using panel interconnect (PIC) bracket assemblies with U-clip portions and flange plates, bonded to panel face sheets, and secured by fasteners, allowing for stress-free assembly with three-point support, liquid shimming, and expansion pins for repeatable installation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If aluminum honeycomb panels with embedded inserts are used for spacecraft platforms, then the structure provides a foundation for mounting systems and instruments, but the durability and reliability are insufficient for rigorous space environmental demands
Solution Approach 1:
The patent employs composite materials including aluminum honeycomb panels with titanium inserts and bracket assemblies with adhesive bonding and mechanical fastening. This combination of materials with different properties (aluminum for lightweight, titanium for strength and corrosion resistance, adhesive for stress distribution) creates a platform structure that achieves both high reliability and structural strength suitable for space environmental demands.
2Ease of operation
If standard embedded inserts and honeycomb panels are used, then the platform provides basic structural support, but flexibility for accessing internal units during Assembly, Integration, and Testing is limited
Solution Approach 1:
The patent segments the platform structure into modular components including removable panel assemblies, bracket assemblies, and internal units. This segmentation allows individual panels to be removed for accessing internal units during AI&T operations, providing ease of operation while maintaining overall structural integrity through the modular design framework.
Solution Approach 2:
The patent implements dynamic characteristics in the platform structure through removable and reconfigurable components. Panels can be removed and reinstalled, bracket assemblies can be detached and reattached, providing the flexibility needed for AI&T operations while the overall structural framework remains stable and controlled.
3Reliability
If externally attached cleats are used as alternative platform components, then the structure provides mounting capability, but consistency and reliability under space operation conditions remain undefined
Solution Approach 1:
The patent incorporates preliminary action through pre-assembled bracket assemblies with pre-applied adhesive bonding and pre-installed mechanical fasteners. These components are prepared and tested before integration into the final platform structure, ensuring manufacturing consistency and reliability while reducing variability in the assembly process.
Solution Approach 2:
The patent utilizes parameter changes in the bonding process, including controlled adhesive application, curing temperature, and fastener torque specifications. By precisely controlling these parameters during manufacturing and assembly, the patent achieves consistent and reliable connections that meet space operation requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides a strong, stable, and precise platform with AI&T flexibility, ensuring accurate component positioning and easy access to internal units, while maintaining structural integrity and reliability under space conditions.
Implementation Method 1
applying adhesive between the first and second bracket arms of the first and second brackets to bond the PIC bracket assemblies to the first and second platform panels
Implementation Method 2
reinstalling the first or second panel using an expansion pin in the co-drilled holes to return the first or second platform panel to its quasi 0G shape
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
Systems, methods, and bracket assemblies for a stable and repeatable spacecraft platform structure are provided. The method includes: providing a plurality of panel interconnect (PIC) bracket assemblies for connecting first and second adjacent platform panels; supporting and aligning the first and second platform panels in a vertical configuration using three points of support; installing the PIC bracket assemblies between the first and second platform panels; co-drilling a subset of the PIC bracket assemblies to establish co-drilled holes that traverse the first and second bracket; disassembling the bolted interfaces of PIC bracket assemblies to remove the first or second platform panel; and reinstalling the first or second panel using an expansion pin in the co-drilled holes to return the first or second platform panel to its quasi 0G shape.