Spacecube V2.0 Flight Card Frame Thermal Management
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Solution Overview
Problem
Current space-based processing systems, such as the SpaceCube™, face challenges with thermal management and structural integrity due to increased stiffness, mass density, and power dissipation, which are not adequately addressed by traditional mechanical and thermal shielding techniques, especially in longer duration missions requiring higher reliability.
Innovation Solution
An electronic assembly support system comprising a frame with side rails, cross rails, and heat dissipation mechanisms like heat pipes or straps, along with a shield and thermal pad material, designed to provide improved thermal and structural integrity for high power dissipation and complex electronic card assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are mounted in a back to back mirror image configuration to increase processing power, then processing capability is improved, but stiffness and mass density increase causing solder joint fatigue and thermal management issues
Solution Approach 1:
The patent divides the electronic assembly into multiple separate cards mounted on a common carrier board, with each card containing specific components. This segmentation allows independent thermal management and mechanical support for each card, reducing the cumulative stiffness and heat concentration that would occur with back-to-back mirror image mounting.
Solution Approach 2:
The patent introduces a foam core material as an intermediary between the electronic cards and the carrier board. This foam core reduces the mechanical stiffness transmission to solder joints while providing thermal management capabilities, thus protecting against solder joint fatigue without compromising the high processing power configuration.
2Temperature
If traditional thermal management techniques like heatsinks are used, then heat dissipation is improved, but size and weight increase beyond design parameters
Solution Approach 1:
The patent changes the thermal management approach from traditional solid heatsinks to a foam core material with specific thermal conductivity parameters. This foam material provides adequate heat dissipation for the high power dissipation electronics while maintaining a compact form factor and minimal weight increase, fitting within the nanosatellite design constraints.
3Productivity
If radiation tolerant FPGA technology is used to increase computing power, then processing capability is improved, but power dissipation density increases creating thermal management challenges
Solution Approach 1:
The patent applies different material properties to different regions of the assembly. The foam core material is specifically positioned around high power dissipation areas to provide localized thermal management. This allows the radiation tolerant FPGAs to operate at high power densities while the surrounding foam material conducts heat away from critical components without requiring a complete redesign of the entire assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability and thermal management of electronic assemblies, reducing susceptibility to vibration fatigue and electromagnetic interference while meeting stringent environmental and radiation requirements, suitable for a wide range of applications including space missions.
Implementation Method 1
heat dissipation mechanisms like heat pipes or straps
Implementation Method 2
heat dissipation mechanisms like heat pipes or straps
Implementation Method 3
thermal pad material
Data Source
AI summary
An electronic assembly support system includes a frame having a plurality of side rails side rails to be positioned along a longitudinal axis of an electronic assembly, a plurality of cross rails connected between the side rails, positioned to surround predetermined components of the electronic assembly, and a first fastener interface for attaching the plurality of side rails and cross rails to the electronic assembly.