Spacer Ball Package Structure for Uniform Bond Line Thickness
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Solution Overview
Problem
There is a need for packages that perform better and are smaller in size, with existing packages facing challenges in achieving consistent and reliable electrical connections between integrated devices due to variations in bond line thickness.
Innovation Solution
The use of a package design that includes a first integrated device with interconnects, coupled to a second integrated device through solder interconnects and spacer balls, with a polymer layer in between to ensure uniform spacing and robust solder joints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If integrated devices are coupled directly without spacers, then device complexity is reduced, but bond line thickness becomes inconsistent and reliability deteriorates
Solution Approach 1:
Spacer balls are introduced as intermediary elements between integrated devices to maintain consistent bond line thickness. These spherical spacers act as mediators that ensure uniform spacing during the bonding process, preventing direct contact between devices and guaranteeing reliable solder joints throughout the bonding area.
2Productivity
If package size is reduced, then productivity and integration density improve, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The spacer balls serve as precision-setting intermediaries that define the exact bond line thickness. By placing these standardized spherical elements between devices, the manufacturing process achieves consistent spacing even in compact package configurations, enabling high integration density without sacrificing bonding precision.
Solution Approach 2:
The use of spacer balls with controlled dimensions allows precise control of the bond line thickness parameter. By selecting spacers with specific sizes and placing them strategically, the patent maintains consistent bonding parameters across different package scales, enabling both miniaturization and manufacturing precision.
3Manufacturing precision
If pressure is applied uniformly during bonding, then manufacturing ease improves, but bond line thickness consistency deteriorates without spacers
Solution Approach 1:
Spacer balls are placed between integrated devices before the bonding process begins. This preliminary action pre-establishes the desired bond line thickness and spacing, so that when bonding pressure is applied, the spacers maintain uniform gaps without requiring complex pressure control mechanisms during the actual bonding operation.
Data Source
AI summary
A package that includes a first integrated device comprising a first plurality of interconnects; a plurality of solder interconnects coupled to the first plurality of interconnects; a second integrated device comprising a second plurality of interconnects, wherein the second integrated device is coupled to the first integrated device through the second plurality of interconnects, the plurality of solder interconnects and the first plurality of interconnects; a polymer layer located between the first integrated device and the second integrated device; and a plurality of spacer balls located between the first integrated device and the second integrated device.