Spacer-Based Workpiece Support for Clean Semiconductor Handling

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Solution Overview

Problem

Semiconductor manufacturing processes are prone to contamination and defects due to residue formation and contact damage during the handling and processing of workpieces, particularly in sensitive areas like the lithography frame, leading to defective devices and reduced production yields.

Innovation Solution

A workpiece support design that minimizes contact points with the underside of the workpiece, positioning these points outside sensitive areas and using spaced-apart spacers to reduce contamination and damage, thereby minimizing defects and residue accumulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the workpiece support uses a conventional design with larger contact areas, then the workpiece is more stable during processing, but the risk of contamination and damage to the workpiece underside increases

Engineering Contradiction:

Improveworkpiece stabilityVSAvoidcontamination and damage risk

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The workpiece support contact surface is segmented into multiple discrete contact points rather than a continuous large contact area. The support structure includes multiple support elements (such as pins or points) that contact the workpiece underside at separated locations, reducing the continuous contact area while maintaining distribution of support forces.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The workpiece support design applies different contact characteristics to different locations. Contact points are strategically positioned outside the lithography frame area where high quality is needed, while allowing larger contact areas in non-critical regions. This creates local variations in contact quality matching the functional requirements of different workpiece zones.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If the workpiece support minimizes contact points to reduce contamination, then the risk of damage to sensitive areas decreases, but the workpiece may become less stable during processing

Engineering Contradiction:

Improvecontamination and damage riskVSAvoidworkpiece stability

Core Design Contradiction:

Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The support structure is divided into multiple discrete support elements distributed across the base. Each element provides localized support at specific contact points, collectively achieving stable support while maintaining minimal individual contact areas that reduce contamination risk.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support structure utilizes three-dimensional positioning with support elements at different heights or angles. This dimensional variation allows the support to provide stable mechanical support through geometric configuration rather than relying on large contact areas, achieving stability through spatial arrangement rather than surface area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If contact points are positioned within the lithography frame area, then the workpiece support is simpler to design, but defects and contamination occur in critical device fabrication areas

Engineering Contradiction:

Improvesupport design complexityVSAvoiddefect rate in lithography frame

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The support structure is segmented into multiple discrete support elements that can be independently positioned. This segmentation allows precise placement of contact points in non-critical areas while maintaining support functionality, achieving the required precision without excessive overall design complexity.

Inventive Principle:

Principle #1Segmentation

4Object-generated harmful factors

If the workpiece support uses spaced-apart spacers, then residue accumulation is reduced, but the manufacturing complexity of the support structure increases

Engineering Contradiction:

Improveresidue accumulationVSAvoidsupport structure complexity

Core Design Contradiction:

Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The design extracts and removes the problematic continuous contact surface, replacing it with discrete support elements. This extraction of the contact function into separate, spaced-apart elements eliminates the conditions that promote residue accumulation while adding only minimal structural complexity.

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS20230375945A1Workpiece support

Publication Date: 2023.11.23 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

The present disclosure is directed to workpiece support for supporting a workpiece during semiconductor processing. The workpiece support includes one or more support frame bodies including a plurality of spaced apart spacers on a first surface of the support frame bodies. The spacers include a first surface spaced apart from the first surface of the support frame body. The spacing between the first surface of the spacers and the first surface of the support frame body results in the underside of the workpiece contacting the spacers but not contacting the first surface of the support frame body. Portions of the underside of the workpiece that do not contact the first surface of the support frame body are less susceptible to damage or accumulation of unwanted debris.