Avalanche Photodiode Doping Structure for Low-Voltage SPAD Pixels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Single photon avalanche diodes (SPADs) require high drive voltages and large electric power, leading to heat generation and deterioration of element characteristics. Additionally, reducing the size of SPAD pixels increases dark current due to high lateral electric fields.
Innovation Solution
A photoelectric conversion element with a semiconductor layer having a first and second face, including a first semiconductor region, a second semiconductor region, a third semiconductor region, a first impurity doped region, and electrodes. The avalanche photodiode is configured to multiply signal charges, with a specific impurity density and depth distribution to reduce the drive voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If SPAD pixels are reduced in size, then detection sensitivity is improved, but dark current increases due to high lateral electric fields
Solution Approach 1:
The patent applies local quality by creating a guard ring structure with specific impurity concentration gradients around the SPAD pixel. The guard ring has a first region with higher impurity concentration and a second region with lower impurity concentration, forming a localized electric field distribution that suppresses surface leakage current without affecting the central detection region. This local modification of electric field characteristics reduces dark current while maintaining the small pixel size for high detection sensitivity.
Solution Approach 2:
The guard ring structure acts as an intermediary element between the high-impurity cathode region and the low-impurity active region. By introducing this intermediate structure with controlled impurity gradients, the patent mediates the electric field distribution to prevent direct lateral field effects that would otherwise cause increased dark current in miniaturized pixels. The guard ring serves as a buffer zone that maintains electrical isolation while allowing the small pixel dimensions to be maintained.
2Reliability
If high impurity density is used in both cathode and anode regions, then contact properties are improved, but lateral electric field increases causing higher dark current
Solution Approach 1:
The patent applies local quality by differentiating the impurity concentration distribution in different spatial regions. The cathode region maintains high impurity concentration for good contact properties, while the guard ring transitions to lower impurity concentration in its second region to reduce lateral electric fields. This localized variation in impurity quality allows simultaneous optimization of contact properties and dark current suppression.
Solution Approach 2:
The guard ring is segmented into multiple regions with different impurity concentrations. The first region has higher impurity concentration to maintain electrical connection, while the second region has lower impurity concentration to reduce lateral electric field effects. This segmentation of the guard ring structure allows it to fulfill multiple functions: providing electrical continuity while simultaneously suppressing dark current through reduced lateral fields in the lower-impurity region.
3Power
If high drive voltage is applied to SPAD, then avalanche multiplication is achieved, but heat generation and element deterioration increase
Solution Approach 1:
The patent applies parameter changes by modifying the impurity concentration distribution in the guard ring structure. By creating a gradient from high to low impurity concentration, the electric field distribution is altered to achieve more efficient avalanche multiplication. This parameter modification allows the SPAD to operate at lower drive voltages while maintaining multiplication capability, thereby reducing heat generation and element deterioration.
Solution Approach 2:
The guard ring structure converts the potentially harmful high lateral electric fields into a beneficial vertical electric field distribution. By using the impurity gradient to shape the electric field, the patent transforms what would be a source of dark current (lateral fields) into a mechanism for improving avalanche multiplication efficiency. The same structural feature that suppresses dark current also enhances the useful avalanche effect at lower voltages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a reduction in drive voltage, leading to energy savings, reduced heat generation, lower dark current, and improved element characteristics.
Implementation Method 1
The SPAD uses an avalanche multiplication phenomenon generated by a strong electric field induced in a p-n junction of a semiconductor to multiply a signal carrier excited by a photon to about several hundred times to several million times of carriers
Implementation Method 2
By converting the current generated by the avalanche multiplication phenomenon into a pulse signal and counting the number of pulse signals, it is possible to directly measure the number of incident photons
Data Source
AI summary
A photoelectric conversion element includes a first semiconductor region of a first conductivity type provided in contact with a first face of a semiconductor layer, a second semiconductor region of a second conductivity type provided closer to a second face of the semiconductor layer than the first semiconductor region, and a third semiconductor region provided closer to the second face than the second semiconductor region. The first semiconductor region and the second semiconductor region constitute an avalanche photodiode, and the avalanche photodiode is configured to multiply a signal charge generated in the third semiconductor region. A width in a depth direction of a region having an effective impurity density of 1×1016 cm−3 or more of the second semiconductor region is 0.5 μm or less.


