Reconfigurable SPAD High-Voltage Circuit for Dual HV Configurations
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Solution Overview
Problem
Existing time-of-flight systems face space and cost inefficiencies due to external high voltage generation circuitry, requiring separate SOCs for different configurations, and lack a universal SOC that can support both external and integrated high voltage generation.
Innovation Solution
A reconfigurable system-on-a-chip (SOC) with a reconfigurable high voltage controller that can operate with either external or integrated high voltage generation circuitry, allowing a single SOC to be used in both configurations, reducing space and cost by integrating boost controller and inductor within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If high voltage generation circuitry is placed external to the package, then the system has flexibility in configuration, but the space occupied increases and manufacturing complexity increases
Solution Approach 1:
The patent merges the high voltage generation circuitry (boost converter, inductor, controller) with the system-on-a-chip package into a single integrated unit. This consolidation eliminates the need for external high voltage components while maintaining configuration flexibility through software-controlled reconfigurability of the integrated circuit.
Solution Approach 2:
The reconfigurable system-on-a-chip is designed to perform multiple functions: it can operate with external high voltage generation circuitry in traditional systems, or with integrated high voltage generation in compact systems. The same chip architecture supports both configurations through programmable control, eliminating the need for different chip designs.
2Reliability
If separate SOCs are manufactured for different configurations, then each SOC is optimized for its specific use, but manufacturing complexity and cost increase due to multiple production lines
Solution Approach 1:
A single reconfigurable SOC design is created that can be manufactured on one production line and then programmed to function in different configurations. The chip includes programmable control logic that allows it to adapt to either external or integrated high voltage generation modes, eliminating the need for multiple specialized SOC designs and production lines.
Solution Approach 2:
The SOC incorporates dynamic reconfigurability through software control, allowing the same hardware to change its operational characteristics based on the configuration. This dynamic adaptation enables a single manufactured chip to serve multiple purposes that previously required different dedicated chips.
3Area of stationary object
If high voltage generation circuitry is integrated within the package, then space is reduced and cost is reduced, but the SOC must support both external and integrated configurations
Solution Approach 1:
The reconfigurable SOC is designed with universal interfaces and control logic that support both external and integrated high voltage generation configurations. The same chip can be programmed to work with external circuitry when needed, or utilize integrated components for compact designs, providing configuration compatibility across different application scenarios.
Solution Approach 2:
The SOC employs dynamic reconfiguration capabilities where the control logic can switch between different operational modes. When integrated high voltage generation is used, the system operates in one mode; when external circuitry is connected, the same chip can reconfigure its control logic to work with the external components, maintaining adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SOC design allows for a single SOC to support both external and integrated high voltage generation setups, optimizing space usage and reducing manufacturing complexity and costs by using a single production line.
Implementation Method 1
a boost converter 20 that alternatingly creates a connection that transfers energy from the battery VBAT to an inductor L and disrupts that connection to thereby create a ripple current that is used to generate the high voltage (VHV)
Implementation Method 2
When the SPAD 14 is struck by an incoming photon, an output pulse is sourced from the anode of the SPAD 14
Implementation Method 3
The higher a SPAD is biased above its breakdown voltage, the more photosensitive the SPAD becomes in operation
Data Source
Figure 1~3
Figure 4~5
Figure 6A~6B
AI summary
A system-on-a-chip (SOC) within a package includes a reference generator, a matching circuit, a programmable current generator, a PWM controller, an overvoltage/undervoltage detector receiving a high voltage from a third output pad, a multiplexer passing an input signal to a second output pad, and a SPAD receiving the high voltage. Switching circuitry includes a first switch between the reference generator and an input of the programmable current generator, a second switch between the input of the current generator and the output of the matching circuit, a third switch between the reference generator and an input of the matching circuit, a fourth switch between an output of the current generator and a tap of a ladder within the overvoltage/undervoltage detector, a fifth switch between an output of the current generator and the first output pad, and a sixth switch between the output of the PWM controller and the first output pad.