SPAD Image Sensor DBR Light Reflection
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Solution Overview
Problem
Existing SPAD image sensors suffer from light loss due to absorption by light-absorbing substrates and inefficient light directionality, particularly when using metal reflectors that risk electrical shorts.
Innovation Solution
A distributed Bragg reflector (DBR) composed of alternating insulating layers with different refractive indices is introduced between the substrate and interconnect structure, enhancing light reflection and resonance efficiency without electrical short risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a metal reflector is used to reflect light, then light reflection efficiency is improved, but the risk of electrical shorts increases
Solution Approach 1:
The patent introduces a dielectric reflector layer (insulating material) as an intermediary between the metal interconnect structure and the substrate. This dielectric layer acts as a mediator that provides both optical reflection functionality and electrical insulation, thereby maintaining light reflection efficiency while eliminating the risk of electrical shorts between metal layers and the substrate.
2Strength
If the substrate is made light-absorbing, then mechanical strength is improved, but light loss increases
Solution Approach 1:
The patent converts the harmful light-absorbing property of the substrate into a beneficial feature by using the substrate's natural absorption to suppress unwanted background signals and noise. Meanwhile, the desired signal light is reflected by the dielectric reflector layer before it can be absorbed, thus converting the substrate's absorption characteristic from a disadvantage into an advantage for signal-to-noise ratio improvement.
3Ease of manufacture
If conventional fabrication processes are used, then manufacturing simplicity is maintained, but fabrication complexity increases due to additional DBR layers
Solution Approach 1:
The patent designs the dielectric reflector layer to serve multiple functions simultaneously: it acts as an optical reflector, an electrical insulator, and an integral part of the interconnect structure. By combining these functions into a single layer structure that can be formed using existing fabrication processes, the patent avoids adding significant complexity while achieving multiple benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The DBR increases the sensitivity and resonance efficiency of SPAD image sensors by effectively reflecting light without electrical shorts, improving light utilization and directionality.
Implementation Method 1
A distributed Bragg reflector (DBR) composed of alternating insulating layers with different refractive indices is introduced between the substrate and interconnect structure, enhancing light reflection and resonance efficiency
Implementation Method 2
A distributed Bragg reflector (DBR) composed of alternating insulating layers with different refractive indices is introduced between the substrate and interconnect structure, enhancing light reflection and resonance efficiency
Implementation Method 3
An image sensor operated in this mode is known as a single photon avalanche diode (SPAD) image sensor, or a Geiger-mode avalanche photodiodes or G-APD
Implementation Method 4
An avalanche process can be triggered when a reverse biased p-n junction receives additional carriers, such as carriers generated by incident radiation. For example, in order to detect radiations with low intensities, the p-n junction is biased above its breakdown voltage, thereby allowing a single photon-generated carrier to trigger an avalanche current that can be detected
Data Source
AI summary
An image sensor is disclosed. The image sensor includes: a common node heavily doped with dopants of a first conductivity type, the common node being within the substrate and abutting the front surface of the substrate; and a sensing node heavily doped with dopants of a second conductivity type opposite to the first conductivity type, the sensing node being within the substrate and abutting the front surface of the substrate; an interconnect structure, wherein the front surface of the substrate faces the interconnect structure; a distributed Bragg reflector (DBR) between the front surface of the substrate and the interconnect structure; a first contact plug passing through the DBR and coupling the common node to the interconnect structure; and a second contact plug passing through the DBR and coupling the sensing node to the interconnect structure.


