SPAD Image Sensor Trench Isolation and Common Node Grid

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Solution Overview

Problem

Existing SPAD image sensors face challenges in achieving high photodetective sensitivity and preventing edge breakdown, which limits their ability to detect low-intensity radiation effectively due to the need for a guard ring that consumes a large area, thereby reducing the fill factor and making it difficult to shrink pixel size while maintaining performance.

Innovation Solution

The SPAD image sensor design incorporates a trench isolation structure and a common node with a grid structure that adjusts the breakdown region, eliminating the need for a guard ring by compensating with a vertical distance, thus enhancing the fill factor and preventing edge breakdown, allowing for efficient detection of low-intensity radiation without sacrificing area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a guard ring is used to prevent edge breakdown, then reliability is improved, but area is consumed and fill factor is reduced

Engineering Contradiction:
Improveedge breakdown preventionVSAvoidpixel area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent removes the guard ring structure from the SPAD device. Instead of using a guard ring to prevent edge breakdown, the invention relies on the intrinsic properties of the depleted region and optimized p-n junction geometry to achieve edge breakdown-free operation, thereby eliminating the area-consuming guard ring structure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent transitions from a planar guard ring structure to a vertically extended depleted region that spans across the edge of the active area. By extending the depletion zone into the depth dimension rather than relying on lateral guard rings, the design prevents edge breakdown without consuming horizontal pixel area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If pixel size is reduced to improve resolution, then productivity is improved, but fill factor decreases making it difficult to maintain performance

Engineering Contradiction:
Improvepixel densityVSAvoidfill factor
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

By removing the guard ring structure, the patent eliminates the non-active area that previously reduced fill factor. This allows the active sensing area to extend closer to the pixel boundaries, maintaining high fill factor even as pixel dimensions are reduced for higher density arrays.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent optimizes the doping concentrations and junction depths to create a depleted region that efficiently covers the active area without requiring lateral guard rings. This parameter optimization enables smaller pixel sizes while maintaining adequate depletion coverage and fill factor.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If reverse bias voltage is increased above breakdown voltage to detect low-intensity radiation, then measurement precision is improved, but edge breakdown occurs causing excessive noise

Engineering Contradiction:
Improvelow-intensity radiation detectionVSAvoidedge breakdown noise
Core Design Contradiction:
Measurement precisionVSObject-generated harmful factors

Solution Approach 1:

The patent removes the guard ring that previously created edge breakdown issues. By eliminating this structure and using optimized junction geometry, the device can operate at high reverse biases above breakdown voltage without experiencing edge breakdown, thus detecting low-intensity radiation with high precision and minimal noise.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent creates a localized optimized depletion region with specific doping profiles that concentrate the electric field in the active sensing area while preventing field concentration at edges. This local quality optimization allows high reverse bias operation with suppressed edge breakdown noise.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables the SPAD image sensor to maintain high photodetective sensitivity while reducing the pixel area, improving the fill factor and preventing excessive noise, allowing for effective detection of low-intensity radiation without the need for a guard ring.

Implementation Method 1

Avalanche photodiodes (APD) are solid devices that are compatible with traditional CMOS devices. An avalanche process can be triggered when a reverse biased p-n junction receives additional carriers, such as carriers generated by incident radiation.

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 2

In order to detect radiations with low intensities, the p-n junction is biased above its breakdown voltage, thereby allowing a single photon-generated carrier to trigger an avalanche current that can be detected.

Methodology Applied
Scientific EffectAvalanche breakdown: Avalanche Breakdown

Data Source

PatentUS10636930B2SPAD image sensor and associated fabricating method
Publication Date: 2020.04.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10636930B2 patent drawing
  • US10636930B2 patent drawing
  • US10636930B2 patent drawing

AI summary

A single photon avalanche diode (SPAD) image sensor is disclosed. The SPAD image sensor includes: a substrate having a front surface and a back surface; wherein the substrate includes a sensing region, and the sensing region includes: a common node heavily doped with dopants of a first conductivity type, the common node being within the substrate and abutting the back surface of the substrate; a sensing node heavily doped with dopants of a second conductivity type opposite to the first conductivity type, the sensing node being within the substrate and abutting the front surface of the substrate; and a first layer doped with dopants of the first conductivity type between the common node and the sensing node.