Spare Logic Circuit Layout to Prevent Leakage Current
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Solution Overview
Problem
Design errors in semiconductor devices often require adding transistors or correcting connections, which increases fabrication time and expense, and existing spare circuits are limited by leakage current, affecting existing circuit routing.
Innovation Solution
Incorporating a spare circuit that acts as a substitute for logic circuits, not initially connected to a power or ground voltage source to prevent leakage current, and connecting it only when necessary to replace a logic circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spare circuit is previously included in the semiconductor device, then design errors can be corrected by substituting the spare circuit for the logic circuit, but leakage current is generated and additional routing schemes are required
Solution Approach 1:
The spare circuit is prepared in advance during fabrication but kept disconnected from power and ground voltage sources. The disconnection is maintained until the spare circuit is actually needed to replace a defective logic circuit, at which point connection is established. This preliminary preparation without premature connection prevents leakage current while ensuring readiness for error correction.
Solution Approach 2:
The harmful factor (leakage current) is eliminated by extracting the connection between the spare circuit and the voltage sources (power and ground). The spare circuit is physically present but electrically isolated until needed, removing the source of leakage current while preserving the substitution capability.
2Reliability
If transistors are added to correct design errors, then the semiconductor device can accommodate design errors, but fabrication time and expenses increase
Solution Approach 1:
Instead of adding transistors during error correction, the solution prepares spare circuits in advance during the initial fabrication process. The spare circuits are fabricated alongside the logic circuits but kept disconnected. When design errors are detected, the correction is achieved by switching connections rather than adding components, significantly reducing fabrication time and complexity.
Solution Approach 2:
The invention creates duplicate (spare) circuits that are identical copies of the logic circuits. These copies are prepared in advance and can substitute for defective logic circuits. The copying is done during initial fabrication without additional transistors, and the substitution is achieved through connection switching rather than physical addition of components.
3Reliability
If a spare circuit is included in the semiconductor device, then design errors can be corrected, but additional routing schemes are necessary affecting existing circuit routing
Solution Approach 1:
The invention extracts the spare circuit from the active routing network by keeping it disconnected from power and ground sources. This isolation eliminates the need for additional routing schemes during normal operation. When substitution is needed, the connection is established, but the routing complexity is minimized because the spare circuit was never part of the active signal path.
Solution Approach 2:
The spare circuit is prepared in advance but kept isolated from the voltage sources and routing network. This preliminary isolation simplifies the routing scheme by excluding the spare circuit from the active routing during normal operation. The connection is established only when needed for substitution, avoiding permanent routing complexity.
Data Source
AI summary
Provided is a semiconductor device and a method of fabricating the same. The semiconductor device may include at least one logic circuit and at least one spare circuit. The at least one spare circuit may be that is a substitute for the at least one logic circuit and may not be connected to a power voltage source and/or a ground voltage source.