Spatial ALD Head Alignment With Closed-Loop Gap Parallelism Control
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Solution Overview
Problem
Conventional spatial atomic layer deposition (SALD) apparatuses lack real-time monitoring and adjustment of the relative positioning between the depositor head and the substrate plate, leading to potential deviations in gap size and parallelism, which can result in unintended mixing of precursor gases and reduced film quality.
Innovation Solution
Incorporation of gap detection sensors and linear actuators into the SALD apparatus to monitor and adjust the gap and parallelism between the depositor head and substrate plate in real-time, ensuring precise alignment and separation of precursor gas zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional SALD apparatuses operate without real-time monitoring, then device complexity is reduced, but manufacturing precision of gap size and parallelism deteriorates
Solution Approach 1:
The patent implements real-time monitoring of gap size and parallelism using sensors that provide feedback to the control system. This feedback loop enables continuous adjustment of the depositor head and substrate plate positioning to maintain precise gap dimensions and parallelism throughout the deposition process, resolving the contradiction between system complexity and manufacturing precision.
Solution Approach 2:
The patent replaces manual mechanical adjustment with automated sensor-based monitoring and control systems. Optical or capacitive sensors substitute for mechanical measurement methods, enabling non-contact, real-time detection of gap size and parallelism deviations, thereby improving precision without proportionally increasing mechanical complexity.
2Manufacturing precision
If real-time monitoring and adjustment mechanisms are added, then manufacturing precision of alignment is improved, but device complexity increases
Solution Approach 1:
Real-time alignment monitoring is achieved through sensors that continuously measure the relative positioning of the depositor head and substrate plate. The control system processes this feedback data and automatically adjusts component positions to maintain precise alignment, thereby improving manufacturing precision while managing system complexity through automated control.
Solution Approach 2:
The monitoring and control system is designed to perform multiple functions: measuring gap size, detecting parallelism deviations, and coordinating positioning adjustments. This multi-functionality reduces the need for separate specialized components, thereby improving alignment precision while minimizing the increase in overall device complexity.
3Ease of operation
If gap size is not maintained uniformly, then ease of operation is improved, but reliability of precursor gas separation deteriorates
Solution Approach 1:
The system continuously monitors gap size uniformity across the deposition area and provides real-time feedback to the positioning control system. This enables automatic correction of non-uniform gap conditions, ensuring reliable precursor gas separation while maintaining ease of operation through automated control rather than manual adjustment.
Solution Approach 2:
The patent implements dynamic adjustment of the depositor head and substrate plate positions to maintain uniform gap size throughout the deposition process. Rather than relying on static, fixed positioning, the system dynamically responds to real-time measurements to ensure consistent gas zone isolation, thereby improving reliability while keeping the system easy to operate.
Data Source
AI summary
A spatial atomic layer deposition apparatus that includes a depositor head having an active surface configured to discharge a flow of a first precursor gas, a flow of a second precursor gas, and a flow of an inert gas that separates the flow of the first precursor gas and the flow of the second precursor gas, a substrate plate that opposes the depositor head and has a support surface for retaining a build substrate, a plurality of gap detection sensors producing an output signal indicative of a distance between the active surface of the depositor head and the support surface of the substrate plate, and a controller that communicates with the plurality of gap detection sensors. The gap detection sensors permit a spatial orientation of the active surface of the depositor head and the support surface of the substrate plate to be determined in real-time and monitored.