Spatial Light Modulator Embedded Circuit Board Thermal Management
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Solution Overview
Problem
Existing packaging arrangements for digital micromirror devices in optical display systems are inadequate for efficient thermal management and mechanical stability, especially in harsh environments like automobiles, where they face extreme temperatures, vibrations, and humidity.
Innovation Solution
An electronic component design that integrates a spatial light modulator device within a circuit board with a Peltier heater/cooler device and a multilayer structure, including a redistribution layer and cavities for thermal and electrical connectivity, minimizing thermal resistance and eliminating the need for additional carriers or connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a spatial light modulator device is packaged using conventional carriers, then mechanical support and electrical connection are provided, but thermal management efficiency deteriorates due to high thermal resistance
Solution Approach 1:
The patent merges the spatial light modulator device directly with the circuit board, eliminating the intermediate carrier. The device is positioned in a cavity formed in the circuit board substrate, with electrical connections made directly to trace layers within the board. This integration removes the carrier component entirely, reducing thermal resistance pathways and simplifying the overall packaging structure while maintaining mechanical support and electrical connectivity functions.
2Stability of the object's composition
If additional carriers and connectors are used for packaging, then mechanical stability is improved, but device complexity and fabrication difficulty increase
Solution Approach 1:
The patent combines multiple functions into the circuit board itself: mechanical support, electrical connection, thermal management, and sealing. The cavity formed in the board provides structural support and positioning for the device, while trace layers provide electrical connections. The board structure itself serves as the packaging housing, eliminating the need for separate carriers and connectors, thereby simplifying fabrication and sealing processes.
Solution Approach 2:
The circuit board is designed to perform multiple functions simultaneously: it provides mechanical support through its rigid structure and cavity, electrical connection through integrated trace layers, thermal management through direct contact pathways, and environmental sealing through its enclosed cavity design. This multi-functionality eliminates the need for separate specialized components for each function.
3Adaptability or versatility
If the spatial light modulator device is exposed to extreme temperatures, then operational versatility is maintained, but reliability deteriorates due to thermal stress and signal degradation
Solution Approach 1:
The patent introduces a thermal management system as an intermediary between the spatial light modulator device and the external environment. This system, integrated into the circuit board structure, actively regulates the device temperature by providing controlled thermal pathways, thereby protecting the device from extreme temperature fluctuations while maintaining operational versatility across different environmental conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal management by actively cooling or heating the spatial light modulator, improving reliability and signal quality in extreme conditions while simplifying fabrication and sealing processes.
Implementation Method 1
A Peltier heater/cooler device is in thermal contact with the spatial light modulator device
Data Source
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AI summary
An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer. The electronic component further comprises a Peltier heater/cooler device, comprising a first heater/cooler surface, at least one pair of thermoelectric members and a second heater/cooler surface. The first heater/cooler surface, the thermoelectric members and the second heater/cooler surface are coplanar and are at least partially embedded between layers of the circuit board. The Peltier heater/cooler device is in thermal contact with the spatial light modulator device.