Spatial Power-Combining Device with Radial Amplifier Connectors
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Solution Overview
Problem
Conventional spatial power-combining devices face limitations in efficiency and output power due to the lossy nature of printed circuit boards at higher frequencies and thermal constraints of amplifiers, which reduce combining efficiency and achievable output power.
Innovation Solution
The spatial power-combining device features a plate with radially arranged amplifier connectors, where output and input antenna signal conductors are completely separated from ground conductors by air, and amplifiers are thermally separated from the center waveguide to improve thermal capabilities, using thermally conductive materials and configurations for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If printed circuit boards are used to support antenna conductors, then mechanical support and form factor are provided, but loss increases at higher frequencies limiting combining efficiency
Solution Approach 1:
The patent extracts the antenna conductors from the lossy printed circuit board substrate and positions them in free space within the waveguide structure. This eliminates the interaction between the signal conductors and the lossy PCB material, thereby reducing signal loss at higher frequencies while maintaining the necessary mechanical support through the waveguide walls and mounting structures.
Solution Approach 2:
The patent introduces air/free space as an intermediary medium between the antenna signal conductors and ground conductors, replacing the printed circuit board substrate. This intermediary eliminates the lossy dielectric material from the signal path while still providing the necessary electrical isolation and mechanical positioning through the waveguide structure.
2Power
If amplifiers are located within the spatial power-combining device, then signal amplification is achieved, but thermal capabilities are limited reducing efficiency and output power
Solution Approach 1:
The patent segments the amplifier assemblies into modular units that can be independently positioned and thermally managed. Each amplifier assembly is separated from the others and from the central waveguide structure, allowing individual thermal management strategies to be applied to each module, thereby improving overall thermal capabilities and sustaining higher output power.
Solution Approach 2:
The patent introduces thermal management intermediaries such as heat sinks, thermal vias, and cooling structures between the amplifier components and the surrounding environment. These intermediaries facilitate efficient heat dissipation from the amplifiers, allowing them to operate at higher power levels without excessive temperature rise that would limit efficiency and output power.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances efficiency and output power by eliminating lossy materials and improving thermal management, allowing the device to operate effectively across a wide frequency range with increased thermal capabilities.
Implementation Method 1
The plurality of output antenna signal conductors are completely separated from the plurality of output antenna ground conductors by air
Implementation Method 2
using thermally conductive materials and configurations for heat dissipation
Data Source
AI summary
Spatial power-combining devices having amplifier connectors are disclosed. A spatial power-combining device structure includes a plate including a first face, a second face that opposes the first face, an exterior surface between the first face and the second face, and a plurality of amplifier connectors accessible at the exterior surface. A waveguide assembly is coupled to the plate at the first face, the waveguide assembly including an inner housing including a plurality of antenna signal conductors and an outer housing including a plurality of antenna ground conductors. A coaxial waveguide section is coupled to the waveguide assembly. The plurality of amplifier connectors may be radially arranged in the plate. A plurality of amplifier modules are on the exterior surface and coupled to corresponding ones of the plurality of amplifier connectors.