Speaker Active Cooling via Thermoelectric T-Iron Conduction
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Solution Overview
Problem
Dynamic speakers face inefficiencies in heat dissipation, leading to high temperatures that can cause neodymium magnet demagnetization and voice coil burnout, limiting power resistance and increasing costs, as existing methods like metal skeletons, forced convection, and blackening the magnetic circuit have limitations in effectively cooling the speaker.
Innovation Solution
A speaker with an active cooling module using a thermoelectric semiconductor cooling sheet attached to the T-iron for heat conduction, which reduces the temperature of the magnetic circuit system and voice coil, enhancing heat dissipation through a semiconductor cooling sheet connected to a DC power source and a heat sink, ensuring effective thermal contact and efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If forced convection is increased to improve heat dissipation, then heat removal efficiency is improved, but the cooling effect is limited when the heat source is hidden in the speaker
Solution Approach 1:
The patent introduces a heat dissipation plate as an intermediary component between the voice coil (heat source) and the external environment. This plate conducts heat away from the voice coil through thermal conduction, serving as a mediator that transfers heat from the hidden internal source to areas where heat can be more effectively dissipated, thus resolving the limitation of direct forced convection on hidden heat sources
Solution Approach 2:
The patent replaces part of the mechanical forced convection system with a thermal conduction-based heat dissipation plate. Instead of relying solely on air flow mechanics to cool the voice coil, the system uses thermal conduction through the plate to transfer heat, supplementing the mechanical cooling approach with a thermal management approach
2Temperature
If metal skeletons and drum papers are used to improve heat dissipation, then heat removal is improved, but sound quality becomes hard due to small internal damping
Solution Approach 1:
The patent segments the heat dissipation function from the structural and acoustic functions. The heat dissipation plate handles thermal management, while the original skeleton and diaphragm materials can focus on acoustic performance without being compromised by heat dissipation requirements, allowing optimization of both thermal and acoustic properties independently
Solution Approach 2:
The heat dissipation plate serves as an intermediary thermal management component that does not interfere with the acoustic properties of the speaker components. It provides a dedicated thermal conduction path separate from the acoustic transmission path, allowing sound quality to be maintained while improving heat dissipation
3Temperature
If blackening the magnetic circuit and voice coil is done to increase radiation efficiency, then heat radiation between components is improved, but the magnetic circuit reaches heat balance quickly and dissipation cannot be continued
Solution Approach 1:
The patent extracts the heat dissipation function from the magnetic circuit components themselves and relocates it to a dedicated heat dissipation plate. By taking out the thermal management function from the magnet and voice coil, these components can maintain their original properties while the plate handles continuous heat removal, preventing the magnetic circuit from reaching heat balance too quickly
Solution Approach 2:
The patent creates a separate thermal management system (heat dissipation plate) that copies and handles the thermal load without requiring modification of the original magnetic circuit components. This separate system can continuously dissipate heat without affecting the magnetic properties or reaching heat balance with the magnetic circuit
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The active cooling module effectively reduces the speaker's overall temperature, preventing thermal damage, increasing power resistance, and allowing the use of lower-cost neodymium magnets, while being compact, noise-free, and environmentally friendly.
Implementation Method 1
an active cooling module fixed to a back of the T-iron, and the active cooling module cools the magnetic circuit system by means of heat conduction
Implementation Method 2
The active cooling module includes a semiconductor cooling sheet, a fixing member, and a heat sink; the semiconductor cooling sheet is electrically connected to a DC power source, with a cold end being attached to the back surface of the T-iron and a hot end being attached to the heat sink
Data Source
AI summary
A speaker capable of active cooling includes a basin frame, and a vibration system and a magnetic circuit system accommodated in the basin frame. The vibration system includes a diaphragm and a voice coil fixed on the diaphragm through a top end of a winding portion thereof. The magnetic circuit system includes a T-iron, a magnet and a washer, wherein the washer and the magnet are located above the T-iron, a magnetic gap is formed between the washer and the magnet and the T-iron, and the voice coil moves up and down in the magnetic gap. The speaker further comprises an active cooling module fixed to a back of the T-iron, and the active cooling module cools the magnetic circuit system by means of heat conduction.